Surface roughening is a generally accepted way to enhance adhesion between two dissimilar materials. One of the key mechanisms, besides the obvious increase in surface area, is the transition from adhesive to cohesive failure, i.e., crack kinking. This chapter presents several analysis methods to study this phenomenon. First, a semi-analytical approach is discussed in which the competition between adhesive and cohesive cracking is analyzed by means of the theoretical relation between interface and kinking stress intensity factors. Accordingly, the crack kinking location and kinking angle are readily calculated. Second, transient crack propagation simulations are performed to calculate crack paths at a roughened surface by means of cohesive ...
Interface delamination is a key failure mechanism in numerous applications. Microscopic analysis ill...
Interface delamination is a key failure mechanism in numerous applications. Microscopic analysis ill...
Interface delamination is a key failure mechanism in numerous applications. Microscopic analysis ill...
Surface roughening is a generally accepted way to enhance adhesion between two dissimilar materials....
Surface roughening is a generally accepted way to enhance adhesion between two dissimilar materials....
Surface roughening is a generally accepted way to enhance adhesion between two dissimilar materials....
Surface roughening is a generally accepted way to enhance adhesion between two dissimilar materials....
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
It is common practice for polymer-metal interfaces, frequently encountered in microelectronic device...
It is common practice for polymer-metal interfaces, frequently encountered in microelectronic device...
It is common practice for polymer-metal interfaces, frequently encountered in microelectronic device...
Interface delamination is a key failure mechanism in numerous applications. Microscopic analysis ill...
Interface delamination is a key failure mechanism in numerous applications. Microscopic analysis ill...
Interface delamination is a key failure mechanism in numerous applications. Microscopic analysis ill...
Surface roughening is a generally accepted way to enhance adhesion between two dissimilar materials....
Surface roughening is a generally accepted way to enhance adhesion between two dissimilar materials....
Surface roughening is a generally accepted way to enhance adhesion between two dissimilar materials....
Surface roughening is a generally accepted way to enhance adhesion between two dissimilar materials....
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
It is common practice for polymer-metal interfaces, frequently encountered in microelectronic device...
It is common practice for polymer-metal interfaces, frequently encountered in microelectronic device...
It is common practice for polymer-metal interfaces, frequently encountered in microelectronic device...
Interface delamination is a key failure mechanism in numerous applications. Microscopic analysis ill...
Interface delamination is a key failure mechanism in numerous applications. Microscopic analysis ill...
Interface delamination is a key failure mechanism in numerous applications. Microscopic analysis ill...