Numerical analysis of delamination at polymer-metal interfaces depends on phenomenological descriptions of interface adhesion. Therefore, extensive experimental characterization is needed. A physics-based multi-scale framework enables the derivation of interface properties by numerical analysis. Such a framework depends on both molecular and continuum analysis giving information on interfacial behavior at different scales. This work relates to the micro-scale analysis of leadframe/epoxy moulding compound (EMC) interfaces. At the micro-scale, intrinsic adhesion properties resulting from chemical and physical interactions at the molecular scale are used to analyse the geometric effect of leadframe roughness on the resulting macro-scale adhesi...
This paper concentrates on a theoretical examination of the influence of roughness on the adhesive p...
This paper concentrates on a theoretical examination of the influence of roughness on the adhesive p...
This paper concentrates on a theoretical examination of the influence of roughness on the adhesive p...
Numerical analysis of delamination at polymer-metal interfaces depends on phenomenological descripti...
Numerical analysis of delamination at polymer-metal interfaces depends on phenomenological descripti...
Numerical analysis of delamination at polymer-metal interfaces depends on phenomenological descripti...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
A typical reliability issue of electronic packages is the decohesion between the encapsulant materia...
A typical reliability issue of electronic packages is the decohesion between the encapsulant materia...
A typical reliability issue of electronic packages is the decohesion between the encapsulant materia...
This paper concentrates on a theoretical examination of the influence of roughness on the adhesive p...
This paper concentrates on a theoretical examination of the influence of roughness on the adhesive p...
This paper concentrates on a theoretical examination of the influence of roughness on the adhesive p...
This paper concentrates on a theoretical examination of the influence of roughness on the adhesive p...
Numerical analysis of delamination at polymer-metal interfaces depends on phenomenological descripti...
Numerical analysis of delamination at polymer-metal interfaces depends on phenomenological descripti...
Numerical analysis of delamination at polymer-metal interfaces depends on phenomenological descripti...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
A typical reliability issue of electronic packages is the decohesion between the encapsulant materia...
A typical reliability issue of electronic packages is the decohesion between the encapsulant materia...
A typical reliability issue of electronic packages is the decohesion between the encapsulant materia...
This paper concentrates on a theoretical examination of the influence of roughness on the adhesive p...
This paper concentrates on a theoretical examination of the influence of roughness on the adhesive p...
This paper concentrates on a theoretical examination of the influence of roughness on the adhesive p...
This paper concentrates on a theoretical examination of the influence of roughness on the adhesive p...