Prevention of delamination failures by improved design calls for accurate characterization and prediction of mixed-mode interface delamination. In this paper, a combined in situ experimental-numerical approach is presented to fully characterize the interface behavior for delamination prediction. The approach is demonstrated on two types of industrially-relevant interface samples – coated copper lead frame-black molding compound epoxy and uncoated copper lead frame-white molding compound epoxy, – for which the delamination behavior is characterized in detail using a miniaturized in situ SEM mixed-mode bending setup and simulated using a newly developed self-adaptive cohesive zone (CZ) finite element framework. To this end, mixed-mode load-di...
The electronic packages consist of various different materials like molding compound, leadframes and...
The thermo-mechanical reliability of integrated circuits (ICs) gains importance due to the reducing ...
A consistent energy-based cohesive zone model to simulate the mode I delamination behaviour of Fully...
Prevention of delamination failures by improved design calls for accurate characterization and predi...
Interfacial delamination is a key reliability challenge in composites and microelectronic systems du...
Precise characterization of interface delamination in miniature interface structures is an ongoing c...
Interfacial delamination has become one of the key reliability issues in the microelectronic industr...
Interfacial failure in the form of delamination, often results in malfunction or failure of laminate...
Due to the fact that microelectronics is made up from various materials with highly dissimilar therm...
Interfacial delamination is a key reliability challenge in composites and micro-electronic systems d...
Interfacial delamination has become one of the key reliability issues in the microelectronic industr...
Interfacial delamination has become one of the key reliability issues in the microelectronics of por...
Interfacial delamination is a key reliability challenge in composites and micro-electronic systems d...
Delamination is often identified as an important failure mechanism in structures with a high interfa...
The object of this study is the development and implementation of a Cohesive Zone Model (CZM) for in...
The electronic packages consist of various different materials like molding compound, leadframes and...
The thermo-mechanical reliability of integrated circuits (ICs) gains importance due to the reducing ...
A consistent energy-based cohesive zone model to simulate the mode I delamination behaviour of Fully...
Prevention of delamination failures by improved design calls for accurate characterization and predi...
Interfacial delamination is a key reliability challenge in composites and microelectronic systems du...
Precise characterization of interface delamination in miniature interface structures is an ongoing c...
Interfacial delamination has become one of the key reliability issues in the microelectronic industr...
Interfacial failure in the form of delamination, often results in malfunction or failure of laminate...
Due to the fact that microelectronics is made up from various materials with highly dissimilar therm...
Interfacial delamination is a key reliability challenge in composites and micro-electronic systems d...
Interfacial delamination has become one of the key reliability issues in the microelectronic industr...
Interfacial delamination has become one of the key reliability issues in the microelectronics of por...
Interfacial delamination is a key reliability challenge in composites and micro-electronic systems d...
Delamination is often identified as an important failure mechanism in structures with a high interfa...
The object of this study is the development and implementation of a Cohesive Zone Model (CZM) for in...
The electronic packages consist of various different materials like molding compound, leadframes and...
The thermo-mechanical reliability of integrated circuits (ICs) gains importance due to the reducing ...
A consistent energy-based cohesive zone model to simulate the mode I delamination behaviour of Fully...