Plasma-enhanced and thermal atomic layer deposition of Al2O3 using dimethylaluminum isopropoxide , [Al(CH3)2(µ-OiPr)]2, as an alternative aluminum precursor

The authors have been investigating the use of [Al(CH3)2(µ-OiPr)]2 (DMAI) as an alternative Al precursor to [Al(CH3)3] (TMA) for remote plasma-enhanced and thermal ALD over wide temperature ranges of 25–400 and 100–400¿°C, respectively. The growth per cycle (GPC) obtained using in situ spectroscopic ellipsometry for plasma-enhanced ALD was 0.7–0.9¿Å/cycle, generally lower than the >0.9¿Å/cycle afforded by TMA. In contrast, the thermal process gave a higher GPC than TMA above 250¿°C, but below this temperature, the GPC decreased rapidly with decreasing temperature. Quadrupole mass spectrometry data confirmed that both CH4 and HOiPr were formed during the DMAI dose for both the plasma-enhanced and thermal processes. CH4 and HOiPr were also formed during the H2O dose but combustion-like products (CO2 and H2O) were observed during the O2 plasma dose. Rutherford backscattering spectrometry showed that, for temperatures >100¿°C and >200¿°C for plasma-enhanced and thermal ALD, respectively, films from DMAI had an O/Al ratio of 1.5–1.6, a H content of ~5 at.¿% and mass densities of 2.7–3.0¿g¿cm-3. The film compositions afforded from DMAI were comparable to those from TMA at deposition temperatures =150¿°C. At lower temperatures, there were differences in O, H, and C incorporation. 30¿nm thick Al2O3 films from the plasma-enhanced ALD of DMAI were found to passivate n- and p-type Si floatzone wafers (~3.5 and ~2 O¿cm, respectively) with effective carrier lifetimes comparable to those obtained using TMA. Surface recombination velocities o