Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors
- Van Campenhout, J.
- Binetti, P.R.A.
- Rojo-Romeo, P.
- Regreny, P.
- Seassal, C.
- Leijtens, X.J.M.
- Vries, de, T.
- Oei, Y.S.
- Veldhoven, van, P.J.
- Nötzel, R.
- Di Cioccio, L.
- Fédéli, J.-M.
- Smit, M.K.
- Thourhout, Van, D.
- Baets, R.G.F.
DOIAbstract
We present a proof-of-principle demonstration of a low-footprint optical interconnect on a silicon-on-insulator (SOI) chip. The optical link consists of a heterogeneously integrated, InP-based microdisk laser (MDL) and microdetector, coupled to a common SOI wire waveguide. Applying an electrical current to the MDL resulted in a detector current up to 1 muA
Add to ORKG