Laser emission from an InP/InGaAsP thin film epitaxial layer bonded to a Silicon-on-Insulator waveguide circuit was observed. Adhesive bonding using divinyl-tetramethyldisiloxane-benzocyclobutene (DVS-BCB) was used to integrate the InP/InGaAsP epitaxial layers onto the waveguide circuit. Light is coupled from the laser diode into an underlying waveguide using an adiabatic inverted taper approach. 0.9mW optical power was coupled into the SOI waveguide using a 500µm long laser. Besides for use as a laser diode, the same type of devices can be used as a photodetector. 50µm long devices obtained a responsivity of 0.23A/W
The integration of optical functionalities on a chip has been a long standing goal in the optical co...
We present the heterogeneous integration of M-V active opto-electronic devices on top of a silicon-o...
The integration of optical functionalities on a chip has been a long standing goal in the optical co...
Laser emission from an InP/InGaAsP thin film epitaxial layer bonded to a Silicon-on-Insulator wavegu...
Laser emission from an InP/InGaAsP thin film epitaxial layer bonded to a Silicon-on-Insulator wavegu...
Laser emission from an InP/InGaAsP thin film epitaxial layer bonded to a Silicon-on-Insulator wavegu...
Laser emission from an InP/InGaAsP thin film epitaxial layer bonded to a Silicon-on-Insulator wavegu...
InP/InGaAsP photodetectors and lasers were integrated on top of ultra-compact Silicon-on-Insulator w...
Thin film InP/InGaAsP active opto-electronic devices were fabricated on top of Silicon-on-Insulator ...
Thin film InP/InGaAsP active opto-electronic devices were fabricated on top of Silicon-on-Insulator ...
Thin film InP/InGaAsP active opto-electronic devices were fabricated on top of Silicon-on-Insulator ...
Abstract—We critically assess recent progress in the integra-tion of near-infrared photodetectors on...
The integration of optical functionalities on a chip has been a long standing goal in the optical co...
The integration of optical functionalities on a chip has been a long standing goal in the optical co...
The integration of optical functionalities on a chip has been a long standing goal in the optical co...
The integration of optical functionalities on a chip has been a long standing goal in the optical co...
We present the heterogeneous integration of M-V active opto-electronic devices on top of a silicon-o...
The integration of optical functionalities on a chip has been a long standing goal in the optical co...
Laser emission from an InP/InGaAsP thin film epitaxial layer bonded to a Silicon-on-Insulator wavegu...
Laser emission from an InP/InGaAsP thin film epitaxial layer bonded to a Silicon-on-Insulator wavegu...
Laser emission from an InP/InGaAsP thin film epitaxial layer bonded to a Silicon-on-Insulator wavegu...
Laser emission from an InP/InGaAsP thin film epitaxial layer bonded to a Silicon-on-Insulator wavegu...
InP/InGaAsP photodetectors and lasers were integrated on top of ultra-compact Silicon-on-Insulator w...
Thin film InP/InGaAsP active opto-electronic devices were fabricated on top of Silicon-on-Insulator ...
Thin film InP/InGaAsP active opto-electronic devices were fabricated on top of Silicon-on-Insulator ...
Thin film InP/InGaAsP active opto-electronic devices were fabricated on top of Silicon-on-Insulator ...
Abstract—We critically assess recent progress in the integra-tion of near-infrared photodetectors on...
The integration of optical functionalities on a chip has been a long standing goal in the optical co...
The integration of optical functionalities on a chip has been a long standing goal in the optical co...
The integration of optical functionalities on a chip has been a long standing goal in the optical co...
The integration of optical functionalities on a chip has been a long standing goal in the optical co...
We present the heterogeneous integration of M-V active opto-electronic devices on top of a silicon-o...
The integration of optical functionalities on a chip has been a long standing goal in the optical co...