Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H2S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under different solvent systems. Such samples were firstly subjected to high-humidity-H2S conditions for 168 h to simulate the harsh offshore environment. After undergoing corrosion, the primary compounds formed were CuO/Cu2O and Ag2S through SEM, XRD, and XPS analysis. Notably, the incorporation of epoxy resin into sintered copper joints resulted in a remarkable reduction in corrosion and a substantial improvement in elect...
Recent years, the sintered silver paste was introduced and further developed for power electronics p...
The effects of moisture content, temperature, and pollutant mixture on atmospheric corrosion of copp...
Five different epoxy based silver filled adhesives have been tested with respect to their usefulness...
Silver-filled epoxy die attach material is the state-of-the-art in attaching the die containing the ...
Corrosion of electronic systems has been a significant issue in electronic industry nowadays. One of...
This work involves research on a new resin system useful for printed circuit board and protective co...
The current trend for multi-functioning miniaturised devices has driven research and development of ...
Wire bonding technology is the earliest chip level interconnection technology, but it is still the m...
AbstractThis work is related to a comprehensive study on the material dependency for solar cell inte...
Sintered silver (Ag) is one of the most promising interconnect materials for high power electronics ...
In high power electronics packaging, sintered silver nanoparticle joints suffer from thermal-humidit...
AbstractDHP (Deoxidized High Phosphorus(copper is widely used in various heat transfer units such as...
One of the most critical influences of long-term reliability of electronic applications is corrosion...
Adhesive bonded joints are exposed to a range of different environments in aerospace applications. T...
Harsh environment electronics need to maintain their functionality while working at conditions such ...
Recent years, the sintered silver paste was introduced and further developed for power electronics p...
The effects of moisture content, temperature, and pollutant mixture on atmospheric corrosion of copp...
Five different epoxy based silver filled adhesives have been tested with respect to their usefulness...
Silver-filled epoxy die attach material is the state-of-the-art in attaching the die containing the ...
Corrosion of electronic systems has been a significant issue in electronic industry nowadays. One of...
This work involves research on a new resin system useful for printed circuit board and protective co...
The current trend for multi-functioning miniaturised devices has driven research and development of ...
Wire bonding technology is the earliest chip level interconnection technology, but it is still the m...
AbstractThis work is related to a comprehensive study on the material dependency for solar cell inte...
Sintered silver (Ag) is one of the most promising interconnect materials for high power electronics ...
In high power electronics packaging, sintered silver nanoparticle joints suffer from thermal-humidit...
AbstractDHP (Deoxidized High Phosphorus(copper is widely used in various heat transfer units such as...
One of the most critical influences of long-term reliability of electronic applications is corrosion...
Adhesive bonded joints are exposed to a range of different environments in aerospace applications. T...
Harsh environment electronics need to maintain their functionality while working at conditions such ...
Recent years, the sintered silver paste was introduced and further developed for power electronics p...
The effects of moisture content, temperature, and pollutant mixture on atmospheric corrosion of copp...
Five different epoxy based silver filled adhesives have been tested with respect to their usefulness...