Add to ORKGThis thesis discusses the issue of thermal management in typical Ball Grid Array (BGA) packages. It aims to study the behavior of heat dissipation in a single BGA solder joint as well as multiple solder joints through the use of analytical, numerical and experimental techniques. Important factors that contribute to the heat dissipation of BGA packages are analyzed and discussed. Such factors include geometrical condition, material properties and thermal loading on the BGA package.Master of Engineering (MPE
This paper deals with the significance of the thermal management for some modern types of electronic...
In power electronics, system-in-package (SiP) designs require an approach for the development of an ...
[[abstract]]This study investigated how the internal temperature and moisture of a plastic ball grid...
This thesis discusses the issue of thermal management in typical Ball Grid Array (BGA) packages. It ...
In power electronic designs, preliminary thermal analysis is essential when choosing packages and po...
Simplified integrated approaches to thermal modeling of electronics packages call for fast and easy ...
Simplified integrated approaches to thermal modeling of electronics packages call for fast and easy ...
Simplified integrated approaches to thermal modeling of electronics packages call for fast and easy ...
Simplified integrated approaches to thermal modeling of electronics packages call for fast and easy ...
Simplified integrated approaches to thermal modeling of electronics packages call for fast and easy ...
[[abstract]]The thermally enhanced ball grid array (TEBGA) electronic packaging under thermal cyclin...
This paper deals with the significance of the thermal management for some modern types of electronic...
[[abstract]]The thermally enhanced ball grid array (TEBGA) electronic packaging under thermal cyclin...
In this study, the stress-strain distributions and interface failure in a BGA (Ball Grid Array) pack...
The ball grid array (BGA) is a type of popular and competitive package in electronic flip-chip packa...
This paper deals with the significance of the thermal management for some modern types of electronic...
In power electronics, system-in-package (SiP) designs require an approach for the development of an ...
[[abstract]]This study investigated how the internal temperature and moisture of a plastic ball grid...
This thesis discusses the issue of thermal management in typical Ball Grid Array (BGA) packages. It ...
In power electronic designs, preliminary thermal analysis is essential when choosing packages and po...
Simplified integrated approaches to thermal modeling of electronics packages call for fast and easy ...
Simplified integrated approaches to thermal modeling of electronics packages call for fast and easy ...
Simplified integrated approaches to thermal modeling of electronics packages call for fast and easy ...
Simplified integrated approaches to thermal modeling of electronics packages call for fast and easy ...
Simplified integrated approaches to thermal modeling of electronics packages call for fast and easy ...
[[abstract]]The thermally enhanced ball grid array (TEBGA) electronic packaging under thermal cyclin...
This paper deals with the significance of the thermal management for some modern types of electronic...
[[abstract]]The thermally enhanced ball grid array (TEBGA) electronic packaging under thermal cyclin...
In this study, the stress-strain distributions and interface failure in a BGA (Ball Grid Array) pack...
The ball grid array (BGA) is a type of popular and competitive package in electronic flip-chip packa...
This paper deals with the significance of the thermal management for some modern types of electronic...
In power electronics, system-in-package (SiP) designs require an approach for the development of an ...
[[abstract]]This study investigated how the internal temperature and moisture of a plastic ball grid...