Add to ORKGIn this project, the sol-gel intermediate layer bonding is demonstrated to provide high bond strength at low temperature (such as 100 degree celsius).Master of Engineerin
To confirm the uniformity on the whole bonded pair by means of a variety of surface energy testings ...
In present study, two low temperature wafer bonding methods, namely the medium vacuum wafer bonding ...
The breakthrough of directwafer bondingwas achieved with siliconon-insulator (SOI) allowing for high...
Itigh strength bonds can be formed between portions of silicon wafer coated with reflowed BPSG at te...
Sol-gel bonds have been produced between smooth, clean silicon substrates by spin-coating solutions ...
Sol–gel bonds have been produced between smooth, clean silicon substrates by spin-coating solutions ...
Low temperature bonding of silicon wafers was achieved using sol-gel technology. The initial sol-gel...
Low temperature bonding of silicon wafers was achieved using sol-gel technology. The initial sol-gel...
In this paper a new class of modified silicon direct bonding processes is presented. The new process...
Project (M.S., Electrical and Electronic Engineering) -- California State University, Sacramento, 20...
This paper will give an overview on up to date research results for wafer bonding technologies using...
Low temperature bonding of silicon wafers was achieved using sol–gel technology. The initial sol–gel...
In microsystems technologies, frequently complex structures consisting of structured or plain silico...
Sol-gel bonds were produced between smooth, clean silicon or polycrystalline alumina substrates by s...
This paper is focused on a modified process for silicon direct bonding. Thin intermediate sodium sti...
To confirm the uniformity on the whole bonded pair by means of a variety of surface energy testings ...
In present study, two low temperature wafer bonding methods, namely the medium vacuum wafer bonding ...
The breakthrough of directwafer bondingwas achieved with siliconon-insulator (SOI) allowing for high...
Itigh strength bonds can be formed between portions of silicon wafer coated with reflowed BPSG at te...
Sol-gel bonds have been produced between smooth, clean silicon substrates by spin-coating solutions ...
Sol–gel bonds have been produced between smooth, clean silicon substrates by spin-coating solutions ...
Low temperature bonding of silicon wafers was achieved using sol-gel technology. The initial sol-gel...
Low temperature bonding of silicon wafers was achieved using sol-gel technology. The initial sol-gel...
In this paper a new class of modified silicon direct bonding processes is presented. The new process...
Project (M.S., Electrical and Electronic Engineering) -- California State University, Sacramento, 20...
This paper will give an overview on up to date research results for wafer bonding technologies using...
Low temperature bonding of silicon wafers was achieved using sol–gel technology. The initial sol–gel...
In microsystems technologies, frequently complex structures consisting of structured or plain silico...
Sol-gel bonds were produced between smooth, clean silicon or polycrystalline alumina substrates by s...
This paper is focused on a modified process for silicon direct bonding. Thin intermediate sodium sti...
To confirm the uniformity on the whole bonded pair by means of a variety of surface energy testings ...
In present study, two low temperature wafer bonding methods, namely the medium vacuum wafer bonding ...
The breakthrough of directwafer bondingwas achieved with siliconon-insulator (SOI) allowing for high...