This paper presents an experimental study of the pool boiling phenomena and performance of porous graphite foam evaporators of different structures and thermophysical properties. Two dielectric liquids viz. FC-72 and HFE-7000 were used as working fluids. Block and fin evaporators of different fin-to-block-surface-area ratios (AR) were designed to study the role of the internal pore structure of graphite foams in a compact air-cooled thermosyphon under saturated pool boiling condition for high heat flux electronics cooling applications. The wall temperatures were measured and the boiling heat transfer coefficients were calculated to analyze the boiling performance. It was found that both fin structures with AR = 3.70 and 2.73 result in reduc...
With current growth in electronic systems, their physical sizes decrease, and the spacing between co...
Over the years, heat fluxes from high speed electronic devices are increasing at an alarming rate...
With current growth in electronic systems, their physical sizes decrease, and the spacing between co...
This paper presents an experimental study of the pool boiling phenomena and performance of porous gr...
Rapid developments of new-generation electronic devices in the last few decades have provided the im...
An experimental study on the boiling phenomena and bubble dynamics from the porous graphite foams of...
This thesis is an experimental investigation of the thermal performance during boiling on copper foa...
This report carries out an experimental investigation on the heat transfer characteristics of a pump...
With the ever rapid advances in silicon chip technology, heat fluxes from high speed electronic devi...
An experiment-oriented study of nucleate pool boiling heat transfer on metal-graphite composite surf...
Thermal management in electronic devices is becoming increasingly challenging due to the higher heat...
The objective of this report is to study the effects of 3D printed substrates with porous microstruc...
The article describes the experimental investigation of pool boiling heat transfer on minichannels w...
Ultra-light Porous metallic foams (the metal foam) are novel multi—functinal porous materials,...
Thermosyphons are a promising option for cooling high heat dissipating electronics because of their ...
With current growth in electronic systems, their physical sizes decrease, and the spacing between co...
Over the years, heat fluxes from high speed electronic devices are increasing at an alarming rate...
With current growth in electronic systems, their physical sizes decrease, and the spacing between co...
This paper presents an experimental study of the pool boiling phenomena and performance of porous gr...
Rapid developments of new-generation electronic devices in the last few decades have provided the im...
An experimental study on the boiling phenomena and bubble dynamics from the porous graphite foams of...
This thesis is an experimental investigation of the thermal performance during boiling on copper foa...
This report carries out an experimental investigation on the heat transfer characteristics of a pump...
With the ever rapid advances in silicon chip technology, heat fluxes from high speed electronic devi...
An experiment-oriented study of nucleate pool boiling heat transfer on metal-graphite composite surf...
Thermal management in electronic devices is becoming increasingly challenging due to the higher heat...
The objective of this report is to study the effects of 3D printed substrates with porous microstruc...
The article describes the experimental investigation of pool boiling heat transfer on minichannels w...
Ultra-light Porous metallic foams (the metal foam) are novel multi—functinal porous materials,...
Thermosyphons are a promising option for cooling high heat dissipating electronics because of their ...
With current growth in electronic systems, their physical sizes decrease, and the spacing between co...
Over the years, heat fluxes from high speed electronic devices are increasing at an alarming rate...
With current growth in electronic systems, their physical sizes decrease, and the spacing between co...