On the other hand, nanocomposite thin film shows many special and superior properties that can be used in numerous potential applications, since it is a multi-phase thin film. Nanocomposite thin films can be defined as the thin films that are composed of at least two different phases with one or more presenting in nano-scale. In this study, Cu phase acting as the second phase was incorporated into TaN matrix in order to tune the negative TCR of TaN. Experimental results show that annealed TaN thin films have a negative TCR (-850 ppm/ºC) while Cu films would normally give a positive TCR (+4300 ppm/ºC). It seems rather natural that TaN-Cu nanocomposite could demonstrate a near-zero TCR and the experiment result show that when proper Cu concen...
The structural and electronic properties of fcc-TaN/SiNx nanocomposite thin films deposited by react...
International audienceThe diffusion of Cu through TaN‐based thin layers into a Si substrate has been...
Copper represents the most commonly used interconnect material in ultra large-scale integration (ULS...
TaN-Cu nanocomposite thin films used as materials for thin-film resistors (TFR) were prepared by mag...
TaN-Cu nanocomposite thin films with Cu nanoparticles dispersed in TaN matrix were prepared by react...
With rapid growth in the semiconductor industry, the need for optimization of nanofabrication proces...
Diffusion barrier properties of very thin sputtered Ta and reactively sputtered TaN films used as a ...
High-temperature stability of Cu-based interconnects is of technological importance for electronic c...
Copper-refractory metal composites/alloys are of interest for aerospace and related applications req...
Key findings are presented from a systematic study which evaluated the performance of chemical vapor...
Titanium nitride-Copper (TiN-Cu) nanocomposite films were deposited onto stainless steel substrate u...
Journal ArticleWe have successfully grown epitaxial cubic (Bl-NaCl structure) tantalum nitride films...
International audienceComparative studies of the mechanical behavior between copper, tungsten, and W...
Journal ArticleTaN has become a very promising diffusion barrier material for Cu interconnections, d...
TaNx diffusion barriers with good barrier properties at subnanometer thickness were deposited by pla...
The structural and electronic properties of fcc-TaN/SiNx nanocomposite thin films deposited by react...
International audienceThe diffusion of Cu through TaN‐based thin layers into a Si substrate has been...
Copper represents the most commonly used interconnect material in ultra large-scale integration (ULS...
TaN-Cu nanocomposite thin films used as materials for thin-film resistors (TFR) were prepared by mag...
TaN-Cu nanocomposite thin films with Cu nanoparticles dispersed in TaN matrix were prepared by react...
With rapid growth in the semiconductor industry, the need for optimization of nanofabrication proces...
Diffusion barrier properties of very thin sputtered Ta and reactively sputtered TaN films used as a ...
High-temperature stability of Cu-based interconnects is of technological importance for electronic c...
Copper-refractory metal composites/alloys are of interest for aerospace and related applications req...
Key findings are presented from a systematic study which evaluated the performance of chemical vapor...
Titanium nitride-Copper (TiN-Cu) nanocomposite films were deposited onto stainless steel substrate u...
Journal ArticleWe have successfully grown epitaxial cubic (Bl-NaCl structure) tantalum nitride films...
International audienceComparative studies of the mechanical behavior between copper, tungsten, and W...
Journal ArticleTaN has become a very promising diffusion barrier material for Cu interconnections, d...
TaNx diffusion barriers with good barrier properties at subnanometer thickness were deposited by pla...
The structural and electronic properties of fcc-TaN/SiNx nanocomposite thin films deposited by react...
International audienceThe diffusion of Cu through TaN‐based thin layers into a Si substrate has been...
Copper represents the most commonly used interconnect material in ultra large-scale integration (ULS...