While Silicon remains the dominant material today in matured very-large-scale-integration technology, most of the III-V compound semiconductors are direct bandgap materials with high electron mobilities that are highly sought in advanced space, automobile, and telecommunication applications. Hence, it would be ideal to integrate the best of Silicon and III-V compound semiconductors.DOCTOR OF PHILOSOPHY (EEE
As is well known, Silicon widely dominates the market of semiconductor devices and circuits, and in ...
Effective monolithic integration strategies for high quality quantum III-V nanostructure fabrication...
Waferbonding is a technique that integrates different semiconductors together, in order to obtain hy...
Review paper on heterogenous integration of III-V devices on Si via direct wafer bonding
The continuation of Moore’s law by conventional complementary metal oxide semiconductor (CMOS) scali...
The continuation of Moore’s law by conventional complementary metal oxide semiconductor (CMOS) scali...
Silicon had been a dominant material in the Very Large Scale Integration (VLSI) technology which are...
We summarize our work on creating substrate platforms, processes, and devices for the monolithic int...
Silicon, being the most mature technology in the electronics industry, is facing limitations and cha...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
This thesis presents systematic studies on monolithic heteroepitaxial integration of III-V compound ...
In electronics, the integration of III-V compound semiconductor materials and silicon is a way to so...
We present results on the direct monolithic integration of III-V devices and Si CMOS on a silicon su...
The present work seeks to demonstrate the elegance and simplicity of monolithic integration via plas...
Driven by Moore’s law, semiconductor chips have become faster, denser and cheaper through aggressive...
As is well known, Silicon widely dominates the market of semiconductor devices and circuits, and in ...
Effective monolithic integration strategies for high quality quantum III-V nanostructure fabrication...
Waferbonding is a technique that integrates different semiconductors together, in order to obtain hy...
Review paper on heterogenous integration of III-V devices on Si via direct wafer bonding
The continuation of Moore’s law by conventional complementary metal oxide semiconductor (CMOS) scali...
The continuation of Moore’s law by conventional complementary metal oxide semiconductor (CMOS) scali...
Silicon had been a dominant material in the Very Large Scale Integration (VLSI) technology which are...
We summarize our work on creating substrate platforms, processes, and devices for the monolithic int...
Silicon, being the most mature technology in the electronics industry, is facing limitations and cha...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
This thesis presents systematic studies on monolithic heteroepitaxial integration of III-V compound ...
In electronics, the integration of III-V compound semiconductor materials and silicon is a way to so...
We present results on the direct monolithic integration of III-V devices and Si CMOS on a silicon su...
The present work seeks to demonstrate the elegance and simplicity of monolithic integration via plas...
Driven by Moore’s law, semiconductor chips have become faster, denser and cheaper through aggressive...
As is well known, Silicon widely dominates the market of semiconductor devices and circuits, and in ...
Effective monolithic integration strategies for high quality quantum III-V nanostructure fabrication...
Waferbonding is a technique that integrates different semiconductors together, in order to obtain hy...
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