InGaAs n-channel metal oxide semiconductor field-effect transistors (MOSFETs) were fabricated on germanium-on-insulator (GeOI) substrate for the first time. Integration of InGaAs on a GeOI substrate was achieved using a molecular beam epitaxy (MBE)-grown InAlAs graded buffer. The fabricated MOSFET, with a self-aligned Ni–InGaAs metallic source/drain, achieves good device characteristics. The normalized transconductance (Gm·tox) compares very well with reported data for InGaAs n-MOSFETs formed on bulk InP substrates, and is significantly higher than reported data for In0.53Ga0.47As n-MOSFETs fabricated on Si substrates using a similar growth technique
Silicon-germanium (SiGe) heterojunction metal-oxide-semiconductor field-effect transistors (SiGe HMO...
148 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1988.Described in this thesis are ...
The silicon germanium dots grown in the Stranski-Krastanow mode are used to induce biaxial tensile s...
III-V semiconductors are being considered as promising candidates to replace silicon channel for low...
Rapid melt growth was used to fabricate gate-all-around germanium-on-insulator (GeOI) p-MOSFETs with...
In0.7Ga0.3As channel n-MOSFETs (metal-oxide-semiconductor field-effect transistors) with Si-doped S/...
As Silicon complementary-oxide-semiconductor (CMOS) devices scale into the sub-22nm regime, severe s...
We report on the growth of In 0.30 Ga 0.70 As channel high-electron mobility transistor (HEMT) epi-l...
We report on the fabrication on InGaAs/InP implant free quantum well (IFQW) n-MOSFET devices on 200m...
Silicon-Germanium Heterojunction Metal-Oxide-Semiconductor Field-Effect-Transistors (SiGe HMOSFETs) ...
In this paper, we report MOS heterostructures grown by molecular beam epitaxy on III-V substrates, e...
With the silicon technology reaching the end of the Roadmap soon, III-V devices have been researched...
We report a comparison of material and device characteristics of metamorphic In0.53Ga0.47As channel ...
N-channel Ge MOSFETs are fabricated with the use of a double-layer gate oxide consisting of electron...
Furthering Si CMOS scaling requires development of high-mobility channel materials and advanced devi...
Silicon-germanium (SiGe) heterojunction metal-oxide-semiconductor field-effect transistors (SiGe HMO...
148 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1988.Described in this thesis are ...
The silicon germanium dots grown in the Stranski-Krastanow mode are used to induce biaxial tensile s...
III-V semiconductors are being considered as promising candidates to replace silicon channel for low...
Rapid melt growth was used to fabricate gate-all-around germanium-on-insulator (GeOI) p-MOSFETs with...
In0.7Ga0.3As channel n-MOSFETs (metal-oxide-semiconductor field-effect transistors) with Si-doped S/...
As Silicon complementary-oxide-semiconductor (CMOS) devices scale into the sub-22nm regime, severe s...
We report on the growth of In 0.30 Ga 0.70 As channel high-electron mobility transistor (HEMT) epi-l...
We report on the fabrication on InGaAs/InP implant free quantum well (IFQW) n-MOSFET devices on 200m...
Silicon-Germanium Heterojunction Metal-Oxide-Semiconductor Field-Effect-Transistors (SiGe HMOSFETs) ...
In this paper, we report MOS heterostructures grown by molecular beam epitaxy on III-V substrates, e...
With the silicon technology reaching the end of the Roadmap soon, III-V devices have been researched...
We report a comparison of material and device characteristics of metamorphic In0.53Ga0.47As channel ...
N-channel Ge MOSFETs are fabricated with the use of a double-layer gate oxide consisting of electron...
Furthering Si CMOS scaling requires development of high-mobility channel materials and advanced devi...
Silicon-germanium (SiGe) heterojunction metal-oxide-semiconductor field-effect transistors (SiGe HMO...
148 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1988.Described in this thesis are ...
The silicon germanium dots grown in the Stranski-Krastanow mode are used to induce biaxial tensile s...