Modification of the Hall-Petch relationship for submicron-grained fcc metals

Experimental data show that the conventional Hall-Petch relationship cannot be maintained in its original form for metals having submicrometer structures. We now propose a dislocation model which modifies the Hall-Patch relationship to provide a uniform description of the grain size strengthening of submicron-structured face-centered cubic (f.c.c.) metals and solid solution alloys