A new sofware tool was developed which allows a simulation of two-dimensional ion implantation profiles using a personal computer within a few minutes of computing time. This program, COMPLAN, uses Pearson destributions for the description of vertical dopant distributions and an improved multilayer model for the simulation of the implantation through thin layers. A lateral convolution with a Gaussian profile yields good results for the lateral spread of the implanted ions. The influence of wafer tilting on the shape of two-dimensional implantation profiles can also be simulated. The implantation range parameters needed for B, Sb, P, and As used in COMPLAN are partly from experiments in order to take into consideration the channeling effect ...
textA physically-based 3-dimensional Monte-Carlo simulator has been developed within UT-MARLOWE, whi...
Analytical methods for the description of ion implantation show good agreement with experiment and M...
Shrinking device dimensions require the reduction of high temperature steps or their replacement by ...
Advanced integrated circuit processing requires detailed modeling of each stage of the fabrication, ...
A new method for an accurate and CPU time efficient three-dimensional simulation of ion implantation...
Ion implantation is the most important doping technique for VLSI circuits. In this contribution, mod...
For the measurement of dopant concentrations in two dimensions (2d), a delineation technique has bee...
Numerical simulation of processes has shown to be an important tool for development in the fields of...
The biggest advantage of plasma immersion ion implantation (PIII) is the capability of treating obje...
With shrinking dimensions and growing complexity of advanced ULSI devices three-dimensional effects ...
In this, the first of two papers, the problem of constructing ion implantation profiles in one and t...
This is the second of two papers concerned with fitting Pearson curves to Monte Carlo simulations of...
For the analytical description of doping profiles after Ion Implantation, good multilayer models are...
The high accuracy which is necessary for modern process simulation often requires the use of Monte-C...
[Abstract] A point-source model of ion implantation is proposed for highly-accurate calculation of i...
textA physically-based 3-dimensional Monte-Carlo simulator has been developed within UT-MARLOWE, whi...
Analytical methods for the description of ion implantation show good agreement with experiment and M...
Shrinking device dimensions require the reduction of high temperature steps or their replacement by ...
Advanced integrated circuit processing requires detailed modeling of each stage of the fabrication, ...
A new method for an accurate and CPU time efficient three-dimensional simulation of ion implantation...
Ion implantation is the most important doping technique for VLSI circuits. In this contribution, mod...
For the measurement of dopant concentrations in two dimensions (2d), a delineation technique has bee...
Numerical simulation of processes has shown to be an important tool for development in the fields of...
The biggest advantage of plasma immersion ion implantation (PIII) is the capability of treating obje...
With shrinking dimensions and growing complexity of advanced ULSI devices three-dimensional effects ...
In this, the first of two papers, the problem of constructing ion implantation profiles in one and t...
This is the second of two papers concerned with fitting Pearson curves to Monte Carlo simulations of...
For the analytical description of doping profiles after Ion Implantation, good multilayer models are...
The high accuracy which is necessary for modern process simulation often requires the use of Monte-C...
[Abstract] A point-source model of ion implantation is proposed for highly-accurate calculation of i...
textA physically-based 3-dimensional Monte-Carlo simulator has been developed within UT-MARLOWE, whi...
Analytical methods for the description of ion implantation show good agreement with experiment and M...
Shrinking device dimensions require the reduction of high temperature steps or their replacement by ...