Add to ORKGAlN-Ceramic is very suitable as carrier substrate for multichip modules because of its high thermal conductivity and its coefficient of thermal expansion, which is closely matched to that of Si. Different thin film metallizations were realized on AlN-substrates. A line resolution of 10 mym grid is possible on polished surface. The adhesion of the metallizations on AlN is comparable to that on Al2O3. The reliability of the metallizations was tested by temperature and humidity tets
This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilay...
Thickness dependent thermal conductivity measurements were made on aluminum nitride (AlN)thin films ...
This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilay...
AlN has a good chance of becoming an important substrate material for high-quality hybrid circuits i...
In order to develop reliable mounting and joint technique on aluminium nitride (AlN) ceramics, basic...
AlN has many advantageous properties. These concern a high thermal conductivity, a non-toxic nature,...
Aluminum nitride ceramics (AlN) became of interest as substrate material for hybrid manufacturers. I...
This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilay...
This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilay...
Higher numbers of chip I/Os, rising clock frequencies and the miniaturization are resulting in an in...
Heat dissipation from silicon chips is becoming critical as a result of increasing circuit density a...
Aluminium nitride represents because of excellent properties (high thermal conductivity, low thermal...
This paper focuses on the properties of Si3N4 substrate material with AMB (active metal brazing) cop...
The use of aluminum nitride as a substrate material for microelectronics is examined. A brief look a...
<p>Thickness dependent thermal conductivity measurements were made on aluminum nitride (AlN)thin fil...
This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilay...
Thickness dependent thermal conductivity measurements were made on aluminum nitride (AlN)thin films ...
This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilay...
AlN has a good chance of becoming an important substrate material for high-quality hybrid circuits i...
In order to develop reliable mounting and joint technique on aluminium nitride (AlN) ceramics, basic...
AlN has many advantageous properties. These concern a high thermal conductivity, a non-toxic nature,...
Aluminum nitride ceramics (AlN) became of interest as substrate material for hybrid manufacturers. I...
This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilay...
This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilay...
Higher numbers of chip I/Os, rising clock frequencies and the miniaturization are resulting in an in...
Heat dissipation from silicon chips is becoming critical as a result of increasing circuit density a...
Aluminium nitride represents because of excellent properties (high thermal conductivity, low thermal...
This paper focuses on the properties of Si3N4 substrate material with AMB (active metal brazing) cop...
The use of aluminum nitride as a substrate material for microelectronics is examined. A brief look a...
<p>Thickness dependent thermal conductivity measurements were made on aluminum nitride (AlN)thin fil...
This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilay...
Thickness dependent thermal conductivity measurements were made on aluminum nitride (AlN)thin films ...
This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilay...