Verfahren zum Aufdampfen von SiO < -x-Schichten

The process is intended to permit coating rates of 100 to 1000 nm/s with good layer characteristics using an electron beam line vaporizer. Preferably, colourless transparent SiO-2 Pa. One advantage is that the vapour deposition material moves on the vapour deposition material in a longitudinal and/or transversal direction to the beam deflection direction. The SiO<-x layers are used as barrier layers against gas and water vapour, as protective layers to increase wear resistance and corrosion resistance, as interference layers or as electrical insulation layers. They can be deposited on metal or non-metal substrates