A device for contacting and holding a chip structure has at least one contact point on one of its main surfaces. In order to produce an electrical and mechanical connection, the device comprises a contact pin and a recess in the chip structure, on whose partition the contact point is arranged, whereby the partition is shaped in such a way that it forms a clamping connection with the contact pin when it is inserted in the recess, through which the contact point is pressed against the contact pin
Housing to receive at least one electronic component, such as a chip (11) or similar, and process fo...
A chip arrangement has a connection system consisting of several individual spaced diamond pieces (1...
DE 102010005465 A1 UPAB: 20100915 NOVELTY - The component (1) has a protective layer (4) arranged on...
The invention relates to a device for bonding and holding of the same, having a chip structure as de...
In a chip bonding process, the first bonding bumps are applied to the contact electrodes of a chip, ...
Chip carrier arrangement (23) comprising a chip carrier (23) for the production of a chip housing, s...
DE 19845296 A UPAB: 20000524 NOVELTY - The method involves contacting a chip (2) which comprises at ...
The chip module (20) has at least one chip (22) attached to a chip carrier (21) provided by a foil a...
The method involves arranging an electrically conductive coil (2) on the surface of an insulating ca...
DE 102009012643 A1 UPAB: 20091015 NOVELTY - The structure has column-like contact elements (5) that ...
Known chip devices are produced by coating plastic substrates. The substrate material is brittle and...
WO 200261831 A UPAB: 20020926 NOVELTY - The method involves applying an isotropic adhesive layer to ...
DE 20021698 U UPAB: 20010628 NOVELTY - The integrated circuit includes a chip (1) without casing, an...
A method of producing a chip package includes providing a substrate comprising a first recess having...
DE1004056970 A UPAB: 20060623 NOVELTY - Production of an electrical contact between a first semicond...
Housing to receive at least one electronic component, such as a chip (11) or similar, and process fo...
A chip arrangement has a connection system consisting of several individual spaced diamond pieces (1...
DE 102010005465 A1 UPAB: 20100915 NOVELTY - The component (1) has a protective layer (4) arranged on...
The invention relates to a device for bonding and holding of the same, having a chip structure as de...
In a chip bonding process, the first bonding bumps are applied to the contact electrodes of a chip, ...
Chip carrier arrangement (23) comprising a chip carrier (23) for the production of a chip housing, s...
DE 19845296 A UPAB: 20000524 NOVELTY - The method involves contacting a chip (2) which comprises at ...
The chip module (20) has at least one chip (22) attached to a chip carrier (21) provided by a foil a...
The method involves arranging an electrically conductive coil (2) on the surface of an insulating ca...
DE 102009012643 A1 UPAB: 20091015 NOVELTY - The structure has column-like contact elements (5) that ...
Known chip devices are produced by coating plastic substrates. The substrate material is brittle and...
WO 200261831 A UPAB: 20020926 NOVELTY - The method involves applying an isotropic adhesive layer to ...
DE 20021698 U UPAB: 20010628 NOVELTY - The integrated circuit includes a chip (1) without casing, an...
A method of producing a chip package includes providing a substrate comprising a first recess having...
DE1004056970 A UPAB: 20060623 NOVELTY - Production of an electrical contact between a first semicond...
Housing to receive at least one electronic component, such as a chip (11) or similar, and process fo...
A chip arrangement has a connection system consisting of several individual spaced diamond pieces (1...
DE 102010005465 A1 UPAB: 20100915 NOVELTY - The component (1) has a protective layer (4) arranged on...