The wire-shadow technique is a simple and easy-to-use preparation method of cross-section specimens for TEM investigations. The method has been optimised for thin films on silicon and oxide (sapphire, MgO) substrates. A wire is glued onto the films. During thinning in a modified commercial ion-milling sample holder the shadow of the small wire protects part of the film. Non-shadowed areas of film and substrate are removed by ion sputtering. During ion thinning a sharp edge evoves in the wire shadow. As a consequence, the interface between film and substrate becomes transparent to electrons just at the point at which the wire is eroded away. Different wire materials and thinning geometries were tested. The best results were achieved using an...
Refined silicon nanowires have been prepared by a mild etching process and suspended into liquid in ...
A site-specific technique for cross-section transmission electron microscopy specimen preparation of...
To successfully prepare many of today’s electronic materials, often non-traditional TEM specimen pre...
Abstract We have developed special specimen holders for double-sided low angle ion beam thinning and...
n this article a method is described for preparing cross sections of obliquely deposited metal thin ...
A technique is described for the preparation of thin specimens for transmission electron microscopy ...
Cross-sectional transmission electron microscopy (XTEM) is a very useful technique to study the inte...
Cross-sectional transmission electron microscopy (XTEM) is a very useful technique to study the inte...
Back-etch methods have been widely used to prepare plan view transmission electron microscopy (TEM) ...
TEM and particularly in-situ TEM investigations of shape memory alloys (SMAs) have the potential to ...
The wire electrical discharge machining (EDM) of cross-section with minimum thickness and compliant ...
The most common method used for target preparation of electron-transparent cross-sections in the fie...
A procedure to pattern thin metal films on a nanometer scale with a scanning tunneling microscope (S...
A site specific technique for cross-section transmission electron microscopy specimen preparation of...
We have developed a method of cross-sectioning silicon wafers with high placement precision. It is i...
Refined silicon nanowires have been prepared by a mild etching process and suspended into liquid in ...
A site-specific technique for cross-section transmission electron microscopy specimen preparation of...
To successfully prepare many of today’s electronic materials, often non-traditional TEM specimen pre...
Abstract We have developed special specimen holders for double-sided low angle ion beam thinning and...
n this article a method is described for preparing cross sections of obliquely deposited metal thin ...
A technique is described for the preparation of thin specimens for transmission electron microscopy ...
Cross-sectional transmission electron microscopy (XTEM) is a very useful technique to study the inte...
Cross-sectional transmission electron microscopy (XTEM) is a very useful technique to study the inte...
Back-etch methods have been widely used to prepare plan view transmission electron microscopy (TEM) ...
TEM and particularly in-situ TEM investigations of shape memory alloys (SMAs) have the potential to ...
The wire electrical discharge machining (EDM) of cross-section with minimum thickness and compliant ...
The most common method used for target preparation of electron-transparent cross-sections in the fie...
A procedure to pattern thin metal films on a nanometer scale with a scanning tunneling microscope (S...
A site specific technique for cross-section transmission electron microscopy specimen preparation of...
We have developed a method of cross-sectioning silicon wafers with high placement precision. It is i...
Refined silicon nanowires have been prepared by a mild etching process and suspended into liquid in ...
A site-specific technique for cross-section transmission electron microscopy specimen preparation of...
To successfully prepare many of today’s electronic materials, often non-traditional TEM specimen pre...