Thermomechanical behaviour of chipcard materials

Mechanical reliability issues of modern electronic packaging materials have become of great importance in microtechnologies e.g. in microelectronics and microsystem technology. Mechanical and thermal stresses are one major concern that may cause reliability problems in chipcard packages, too. Chipcards consist of various materials which are combined around the chip-board interconnection area. The paper presents numerical simulation combined with experimental investigation on chipcard modules embedded in card pockets having silicon, FR-4 as board substrate, soft solder bumps and a thin metal layer as contact plate under thermo cycle test conditions