The laser-acoustic method is accepted to be an interesting method of testing thin films. It is based on measuring the dispersion of surface acoustic waves which are generated by short laser pulses. A reliable test equipment was developed that allows a user-friendly operation. The method is non-destructive, the test takes little time and special sample preparation is not required. It is mainly applied to measure the Young's modulus of thin films with thickness down to less than 50 nm. Recent studies showed these results to correlate with important microstructural and mechanical properties of hard and superhard films. The laser- acoustic technique was improved to test multilayer films consisting of two components. The approach of an effective...
The method of ultrasonic surface waves is suitable to determine the elastic modulus of thin diamond-...
Thin films deposited on silicon substrates are very common especially in microelectronic application...
Thin films deposited on silicon substrates are very common especially in microelectronic application...
The laser-acoustic technique based on surface acoustic waves has proved to be an interesting test me...
Surface acoustic waves are elastic vibrations which propagate along the surface of the material. The...
A laser-acoustic test method is presented, which can be used for the non-destructive characterizatio...
The laser-acoustic technique is a promising method to determine Young's modulus of thin films. Wide-...
The mechanical properties are often the main topic, but at least a necessary precondition in the app...
The test method LAwave® measures the dispersion of surface acoustic waves induced by short laser pul...
Young's modulus of diamond-like carbon films varies in a wide range which suggests the use of this m...
The protecting against damage, computer hard disks have to be coated by hard films. The increasing d...
Techniques based on laser-induced surface acoustic waves have been developed with the potential for ...
The laser acoustic method was used for analysis of two layered systems: thin titanium and diamond li...
The thickness of films deposited on substrates is crucial for their thermal, electrical, optical beh...
Ultrasonic surface waves induced by a pulsed laser act as high-frequency elastic oscillations propag...
The method of ultrasonic surface waves is suitable to determine the elastic modulus of thin diamond-...
Thin films deposited on silicon substrates are very common especially in microelectronic application...
Thin films deposited on silicon substrates are very common especially in microelectronic application...
The laser-acoustic technique based on surface acoustic waves has proved to be an interesting test me...
Surface acoustic waves are elastic vibrations which propagate along the surface of the material. The...
A laser-acoustic test method is presented, which can be used for the non-destructive characterizatio...
The laser-acoustic technique is a promising method to determine Young's modulus of thin films. Wide-...
The mechanical properties are often the main topic, but at least a necessary precondition in the app...
The test method LAwave® measures the dispersion of surface acoustic waves induced by short laser pul...
Young's modulus of diamond-like carbon films varies in a wide range which suggests the use of this m...
The protecting against damage, computer hard disks have to be coated by hard films. The increasing d...
Techniques based on laser-induced surface acoustic waves have been developed with the potential for ...
The laser acoustic method was used for analysis of two layered systems: thin titanium and diamond li...
The thickness of films deposited on substrates is crucial for their thermal, electrical, optical beh...
Ultrasonic surface waves induced by a pulsed laser act as high-frequency elastic oscillations propag...
The method of ultrasonic surface waves is suitable to determine the elastic modulus of thin diamond-...
Thin films deposited on silicon substrates are very common especially in microelectronic application...
Thin films deposited on silicon substrates are very common especially in microelectronic application...