Add to ORKGThe present invention relates to a process for material machining using laser radiation. It is characterized by the fact that a number of laser diodes which are coupled in a suitable way to form a laser diode array is provided for generating the laser radiation. Laser radiation emitted by the individual laser diodes is transferred to the machining point by suitable means for beam guidance and shaping, such as microlens and/or fibre-optics, and focused there
Device for the monitoring of workpieces (6) machined by means of laser radiation, in particular CO<-...
Device for the jointing of workpieces using laser radiation, for the welding of a workpiece having a...
A process for the defined adjustment of the shapability of a metal semi-finished product is known, i...
Process for the machining of workpiece surfaces using laser beams for transformation hardening, surf...
Laser radiation has found a wide range of applications as a machining tool for various kinds of mate...
WO 2009143836 A1 UPAB: 20100101 NOVELTY - The process for separate machining of workpieces using a l...
The invention relates to a machining head for machining materials, in particular laser machining, ha...
WO2005093470 A UPAB: 20051114 NOVELTY - Process for preparation of an optical component for electrom...
The description refers to a process for the cutting of wire or tape material by means of laser radia...
The cost of cutting hard-to-machine materials by conventional mechanical machining processes is high...
The invention relates to a process and a device for cutting a brittle body using laser radiation. Th...
The invention relates to a process and a device for cutting a brittle body using laser radiation. Th...
Process for the processing of workpieces by means of laser radiation, which generates a non-shieldin...
The invention relates to a method for machining a semiconductor component having at least one semico...
DE 102009008284 A1 UPAB: 20100826 NOVELTY - In a method for laser-supported machining of high-streng...
Device for the monitoring of workpieces (6) machined by means of laser radiation, in particular CO<-...
Device for the jointing of workpieces using laser radiation, for the welding of a workpiece having a...
A process for the defined adjustment of the shapability of a metal semi-finished product is known, i...
Process for the machining of workpiece surfaces using laser beams for transformation hardening, surf...
Laser radiation has found a wide range of applications as a machining tool for various kinds of mate...
WO 2009143836 A1 UPAB: 20100101 NOVELTY - The process for separate machining of workpieces using a l...
The invention relates to a machining head for machining materials, in particular laser machining, ha...
WO2005093470 A UPAB: 20051114 NOVELTY - Process for preparation of an optical component for electrom...
The description refers to a process for the cutting of wire or tape material by means of laser radia...
The cost of cutting hard-to-machine materials by conventional mechanical machining processes is high...
The invention relates to a process and a device for cutting a brittle body using laser radiation. Th...
The invention relates to a process and a device for cutting a brittle body using laser radiation. Th...
Process for the processing of workpieces by means of laser radiation, which generates a non-shieldin...
The invention relates to a method for machining a semiconductor component having at least one semico...
DE 102009008284 A1 UPAB: 20100826 NOVELTY - In a method for laser-supported machining of high-streng...
Device for the monitoring of workpieces (6) machined by means of laser radiation, in particular CO<-...
Device for the jointing of workpieces using laser radiation, for the welding of a workpiece having a...
A process for the defined adjustment of the shapability of a metal semi-finished product is known, i...