Verfahren zur Prozesskontrolle und -regelung bei der Oberflaechenbearbeitung von Werkstuecken mit gepulster Laserstrahlung

The description refers to a process for closed-loop and open-loop control for the surface treatment of workpieces using pulsed laser radiation and, if necessary, process gas. The invention is characterized by the fact that the laser beam parameters relating to each process, the processing and/or image laser reflected by the process location and the radiation emitted by the processing plasma are measured on-line, and that the measured values are evaluated in an computer-aided control unit by actual/nominal value comparison. Based on this evaluation, the control takes place of the laser beam parameters required to match the actual values to the reference values and/or match the position of the workpiece by means of a suitable handling system and/or supply process gas, or by means of the controlling unit