Verfahren und Vorrichtung zur optischen Kontrolle von Fertigungsprozessen feinstrukturierter Oberflaechen in der Halbleiterfertigung

DE 19922614 A UPAB: 20000807 NOVELTY - The method involves providing reference signatures of fine structure surfaces. At least one signature of a sample surface to be controlled is measured and compared with the reference signatures, and is classified by parameters according to the comparison result. The reference signatures are measured by measuring the spatial or intensity distribution of a diffraction images of qualitative specific production prototypes. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a device for implementing the method. USE - Control of manufacturing processes of fine structure surfaces in semiconductor manufacturing. ADVANTAGE - Enables in situ or in-line application