Chemical modification of a photo definable epoxy resin with polyamines to improve adhesion with electroless deposited copper

The presence of polyamine groups on the surface of dielectrics potentially improves the adhesion with electrochemically deposited metals. In this article, first cyanuric chloride is covalently bound to the surface hydroxyl groups of the epoxy resin. The remaining reactive sites on the coupled cyanuric chloride molecule are the used to anchor polyamines. The surface reactions are monitored and characterized by means of ATR-IR, SEM-EDS, XPS and ToF-SIMS.The presence of polyamine groups on the surface of dielectrics potentially improves the adhesion with electrochemically deposited metals. In this article, first cyanuric chloride is covalently bound to the surface hydroxyl groups of the epoxy resin. The remaining reactive sites on the coupled cyanuric chloride molecule are the used to anchor polyamines. The surface reactions are monitored and characterized by means of ATR-IR, SEM-EDS, XPS and ToF-SIMS.C