Add to ORKGFlux-free application of a solder sphere (102) to a substrate (104) or a chip (108) involves: (a) preliminary treatment and/or cleaning of a region (140) of the surface to be provided with a solder sphere; (b) isolation of the region (140) by means of protective gas from the surroundings; (c) application of a solder sphere to this region. Also claimed is an apparatus for implementation of the method. USE - Used in manufacture of electronic components, for soldering within the so-called fine pitch range. ADVANTAGE - Solder can be applied to substrate or chip surface without use of flux agents
Chlorofluorocarbons (CFCs) have been used for cleaning circuit boards after the soldering process in...
DE 10237495 A UPAB: 20031223 NOVELTY - A new solder material contains at least 0.01 wt.% aluminum. D...
Conventional soldering of electronic components generally requires the application of a chemical flu...
In a method of producing solder bumps on a substrate by contact with a molten solder bath, at least ...
Surface cleaning or activation of an electrically conductive layer (or a conductor line or contact p...
Process for soldering terminal areas of a substrate with molten solder comprising the following proc...
EP 1544320 A UPAB: 20050823 NOVELTY - In a process to manufacture a microelectronic component, a sur...
The invention relates to a solder bump containing an inhomogenous material composition, in particula...
Thesis (M.Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
Known chip devices are produced by coating plastic substrates. The substrate material is brittle and...
DE 102008014577 B3 UPAB: 20090725 NOVELTY - The method involves applying a metallization compound co...
DE 102009050426 B3 UPAB: 20110418 NOVELTY - The method involves providing a carrier substrate with m...
DE1004021259 A UPAB: 20051222 NOVELTY - Production of a semiconductor substrate (102) comprises prep...
DE 10241390 B UPAB: 20040421 NOVELTY - Process for structuring a flat substrate made from glassy mat...
A component (100) is bonded to a substrate (102) by solder (110) while the component is positioned a...
Chlorofluorocarbons (CFCs) have been used for cleaning circuit boards after the soldering process in...
DE 10237495 A UPAB: 20031223 NOVELTY - A new solder material contains at least 0.01 wt.% aluminum. D...
Conventional soldering of electronic components generally requires the application of a chemical flu...
In a method of producing solder bumps on a substrate by contact with a molten solder bath, at least ...
Surface cleaning or activation of an electrically conductive layer (or a conductor line or contact p...
Process for soldering terminal areas of a substrate with molten solder comprising the following proc...
EP 1544320 A UPAB: 20050823 NOVELTY - In a process to manufacture a microelectronic component, a sur...
The invention relates to a solder bump containing an inhomogenous material composition, in particula...
Thesis (M.Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
Known chip devices are produced by coating plastic substrates. The substrate material is brittle and...
DE 102008014577 B3 UPAB: 20090725 NOVELTY - The method involves applying a metallization compound co...
DE 102009050426 B3 UPAB: 20110418 NOVELTY - The method involves providing a carrier substrate with m...
DE1004021259 A UPAB: 20051222 NOVELTY - Production of a semiconductor substrate (102) comprises prep...
DE 10241390 B UPAB: 20040421 NOVELTY - Process for structuring a flat substrate made from glassy mat...
A component (100) is bonded to a substrate (102) by solder (110) while the component is positioned a...
Chlorofluorocarbons (CFCs) have been used for cleaning circuit boards after the soldering process in...
DE 10237495 A UPAB: 20031223 NOVELTY - A new solder material contains at least 0.01 wt.% aluminum. D...
Conventional soldering of electronic components generally requires the application of a chemical flu...