In order to produce a micromechanical surface structure, a sacrificial layer is applied to a substrate and a structure layer is applied to the sacrifical layer. Part of the sacrificial layer is removed to expose a movable section of the sacrificia layer. In order to prevent the movable section of the sacrificial layer from adhering to the substrate, at least that area of the sacrifical layer which is located between the movable section and the substrate is formed from a dry-etchable material. Moreover, uneven areas are provided on the surface of the substrate below the movable section of the surface structure
In this work we present a novel technology for tailoring the edges of a polymer sacrificial layer by...
DE 102007006640 A1 UPAB: 20080903 NOVELTY - The method involves partially covering a surface of a se...
Embodiments of the invention relate to production methods. In a first step, a semiconductor substrat...
DE 102008060796 A1 UPAB: 20100604 NOVELTY - The method involves coating the surface of a projection ...
DE 19946252 A UPAB: 20010522 NOVELTY - A substrate surface is changed by a physical and/or chemical ...
DE 102007013329 A1 UPAB: 20081018 NOVELTY - The method involves applying a conductive strip plane (1...
US 20080241462 A1 UPAB: 20081024 NOVELTY - A deflectable structure (100) has a layer (102) e.g. a pl...
A micromechanical relay production process involves: (a) applying a sacrificial layer (26) onto a su...
US 20090303563 A1 UPAB: 20100101 NOVELTY - An intermediate layer (130) is formed between the carrier...
DE 102006004644 A1 UPAB: 20071008 NOVELTY - The tool has an elastic die web (3) with a negative of a...
US2014339658A [EN] The invention relates to an MEMS structure with a stack made of different layers ...
A surface micromachining technique for the release of high length-to-thickness aspect ratio (800:1) ...
DE 19913612 C UPAB: 20000118 NOVELTY - The method involves preparing a first substrate (4-6) on whic...
This paper presents a new process for releasing micromechanical structures in one-polysilicon layer ...
WO 200138240 A UPAB: 20010822 NOVELTY - Process for structuring surfaces of micromechanical and/or m...
In this work we present a novel technology for tailoring the edges of a polymer sacrificial layer by...
DE 102007006640 A1 UPAB: 20080903 NOVELTY - The method involves partially covering a surface of a se...
Embodiments of the invention relate to production methods. In a first step, a semiconductor substrat...
DE 102008060796 A1 UPAB: 20100604 NOVELTY - The method involves coating the surface of a projection ...
DE 19946252 A UPAB: 20010522 NOVELTY - A substrate surface is changed by a physical and/or chemical ...
DE 102007013329 A1 UPAB: 20081018 NOVELTY - The method involves applying a conductive strip plane (1...
US 20080241462 A1 UPAB: 20081024 NOVELTY - A deflectable structure (100) has a layer (102) e.g. a pl...
A micromechanical relay production process involves: (a) applying a sacrificial layer (26) onto a su...
US 20090303563 A1 UPAB: 20100101 NOVELTY - An intermediate layer (130) is formed between the carrier...
DE 102006004644 A1 UPAB: 20071008 NOVELTY - The tool has an elastic die web (3) with a negative of a...
US2014339658A [EN] The invention relates to an MEMS structure with a stack made of different layers ...
A surface micromachining technique for the release of high length-to-thickness aspect ratio (800:1) ...
DE 19913612 C UPAB: 20000118 NOVELTY - The method involves preparing a first substrate (4-6) on whic...
This paper presents a new process for releasing micromechanical structures in one-polysilicon layer ...
WO 200138240 A UPAB: 20010822 NOVELTY - Process for structuring surfaces of micromechanical and/or m...
In this work we present a novel technology for tailoring the edges of a polymer sacrificial layer by...
DE 102007006640 A1 UPAB: 20080903 NOVELTY - The method involves partially covering a surface of a se...
Embodiments of the invention relate to production methods. In a first step, a semiconductor substrat...