DE 19944410 A UPAB: 20010620 NOVELTY - The device has a bearer plate (1) on which the microstructure is mounted and that is enclosed by a bearer frame (5) at a distance and a connecting arrangement connecting the plate and frame with at least one bridge body (13,14) with bearer frame, bearer plate and intermediate insulation holder connecting sections. The bridge body material has lower thermal conductivity than the bearer plate and bearer frame. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for the following: a method of manufacturing a device for holding a microstructure to be heated. USE - For holding a microstructure to be heated. ADVANTAGE - A relatively high level of mechanical stability is achieved with a relatively low...
DE 10220014 A UPAB: 20040331 NOVELTY - A process for stamping structures on a carrier (1), comprises...
DE 202006006610 U1 UPAB: 20061129 NOVELTY - The housing has a substrate with an electrical circuit, ...
DE 102009034307 A1 UPAB: 20110209 NOVELTY - The method involves forming an electrically conductive l...
DE 10059777 A UPAB: 20020621 NOVELTY - The device has at least one pair of parallel bearer elements ...
DE 10316926 B UPAB: 20041015 NOVELTY - A holder for an optical element (10,11,12) consists of three ...
DE 10158627 A UPAB: 20030813 NOVELTY - The bearer structure has a layer structure, consisting of at ...
DE 10312802 B UPAB: 20040805 NOVELTY - A workpiece carrier in heat resistant fiber bonded ceramic ma...
DE 202009017635 U1 UPAB: 20100729 NOVELTY - The gripping device (1) has a heated and cooled probe (2...
EP 1860248 A2 UPAB: 20080111 NOVELTY - The unit (1) has a plate formed from an insulating material a...
The invention relates to a method for producing lightweight construction structural elements which a...
DE 102005024321 A1 UPAB: 20070129 NOVELTY - The circuit has electrical loads (46a-46n) to generate h...
WO 2009076930 A2 UPAB: 20090707 NOVELTY - Method for producing a soldered connection between two com...
DE 19846958 A UPAB: 20000419 NOVELTY - The apparatus to carry and transport the smallest volumes of ...
DE 102005024346 A1 UPAB: 20070129 NOVELTY - The unit (80) has two connection points, and a fusible m...
DE 10247618 A UPAB: 20040527 NOVELTY - The compound body has base body that is made of a precipitati...
DE 10220014 A UPAB: 20040331 NOVELTY - A process for stamping structures on a carrier (1), comprises...
DE 202006006610 U1 UPAB: 20061129 NOVELTY - The housing has a substrate with an electrical circuit, ...
DE 102009034307 A1 UPAB: 20110209 NOVELTY - The method involves forming an electrically conductive l...
DE 10059777 A UPAB: 20020621 NOVELTY - The device has at least one pair of parallel bearer elements ...
DE 10316926 B UPAB: 20041015 NOVELTY - A holder for an optical element (10,11,12) consists of three ...
DE 10158627 A UPAB: 20030813 NOVELTY - The bearer structure has a layer structure, consisting of at ...
DE 10312802 B UPAB: 20040805 NOVELTY - A workpiece carrier in heat resistant fiber bonded ceramic ma...
DE 202009017635 U1 UPAB: 20100729 NOVELTY - The gripping device (1) has a heated and cooled probe (2...
EP 1860248 A2 UPAB: 20080111 NOVELTY - The unit (1) has a plate formed from an insulating material a...
The invention relates to a method for producing lightweight construction structural elements which a...
DE 102005024321 A1 UPAB: 20070129 NOVELTY - The circuit has electrical loads (46a-46n) to generate h...
WO 2009076930 A2 UPAB: 20090707 NOVELTY - Method for producing a soldered connection between two com...
DE 19846958 A UPAB: 20000419 NOVELTY - The apparatus to carry and transport the smallest volumes of ...
DE 102005024346 A1 UPAB: 20070129 NOVELTY - The unit (80) has two connection points, and a fusible m...
DE 10247618 A UPAB: 20040527 NOVELTY - The compound body has base body that is made of a precipitati...
DE 10220014 A UPAB: 20040331 NOVELTY - A process for stamping structures on a carrier (1), comprises...
DE 202006006610 U1 UPAB: 20061129 NOVELTY - The housing has a substrate with an electrical circuit, ...
DE 102009034307 A1 UPAB: 20110209 NOVELTY - The method involves forming an electrically conductive l...