Verfahren zur Handhabung einer Mehrzahl von Schaltungschips

DE 19840210 A UPAB: 20000502 NOVELTY - The integrated circuit (IC) chips (8) are arranged in a first set-up, corresponding to their arrangement in an original wafer pattern, on the surface of an auxiliary carrier (6). The chips are picked up by receptors (10), which are simultaneously moved with the chips to one or more carriers. Simultaneously with the movement the first chip arrangement is changed into a different second arrangement, in which the chips are placed onto the carrier. The two arrangements define two different spacings between the chips, with the first one smaller than the second one. USE - For the production of chip cards and disposable electronic labels. ADVANTAGE - The facility is provided for parallel handling of the chips even after separation from the wafer pattern