Verfahren zur vertikalen Integration von aktiven Schaltungsebenen und unter Verwendung desselben erzeugte vertikale integrierte Schaltung

DE 19856573 C UPAB: 20000624 NOVELTY - The method involves producing a first substrate (4) with at least one IC in a first main surface and with connection surfaces (8) for the IC on the first main surface and with external connection surfaces (10). DETAILED DESCRIPTION - The process also comprises: producing a second substrate (2) with at least one IC in a first main surface and with connection surfaces (6) for the IC on the first main surface; connecting the first main surfaces of the two substrates so their connection surfaces are electrically connected; reducing the second substrate and freeing the external connection surfaces. AN INDEPENDENT CLAIM is also included for a vertically integrated circuit. USE - For vertical integration of active circuit planes. ADVANTAGE - Enables a considerable simplification of process control