DE 10239091 A UPAB: 20030624 NOVELTY - Wheland complexes are able to initiate the thermal curing of epoxide and/or vinyl ethers, e.g. resin formulations including one or more monomers containing epoxide and/or vinyl group(s) and 0.005-10 wt.% of initiator. The initiator contains one or Wheland complexes. USE - The resin formulation is useful in adhesives, matrix resins, coating materials, casting and sealing compositions and printing inks (all claimed). ADVANTAGE - The resin formulation has high storage stability on uncured storage, can be cured at moderate temperatures, and is easily worked
Epoxy adhesives are primarily composed of epoxy resin and curing agent. Epoxy adhesives are supplied...
Thermosettings polymers are materials with high thermal stability because of its tridimensional cros...
Solid, transparent epoxy-based nanocomposites with organophilic layered silicates as polymerisation ...
Solvent free epoxy resin mixture containing components made of renewable resources (at least 70 wt.%...
It has been widely recognised that high energy radiation can be effectively applied to the cure of e...
The present invention relates to epoxy resin based compositions. Epoxy resins are monomers or prepol...
Epoxy resins are widely used in composites, aerospace, construction, electronic, adhesive and coatin...
Epoxy resins constitute a class of thermosets which contains more than one epoxide group per molecul...
Available from British Library Document Supply Centre-DSC:DXN053300 / BLDSC - British Library Docume...
The modification of epoxy resin curing agents by the incorporation of metal salts offers the opportu...
Amine-curing single-component epoxy resin adhesive compound on an epoxide base having the formula (I...
WO2005078036 A UPAB: 20051019 NOVELTY - Adhesive compositions (I) based on partly crystalline polyet...
Reaction of epoxy-diane resin with complex based on monoamide of phosphonic acid and ammonium chlori...
This work presents a straightforward strategy to introduce highly dynamic and adaptable cross-links ...
A method for the synthesis of an amine-containing epoxy resin curing agent by dissolving hexakis-[(4...
Epoxy adhesives are primarily composed of epoxy resin and curing agent. Epoxy adhesives are supplied...
Thermosettings polymers are materials with high thermal stability because of its tridimensional cros...
Solid, transparent epoxy-based nanocomposites with organophilic layered silicates as polymerisation ...
Solvent free epoxy resin mixture containing components made of renewable resources (at least 70 wt.%...
It has been widely recognised that high energy radiation can be effectively applied to the cure of e...
The present invention relates to epoxy resin based compositions. Epoxy resins are monomers or prepol...
Epoxy resins are widely used in composites, aerospace, construction, electronic, adhesive and coatin...
Epoxy resins constitute a class of thermosets which contains more than one epoxide group per molecul...
Available from British Library Document Supply Centre-DSC:DXN053300 / BLDSC - British Library Docume...
The modification of epoxy resin curing agents by the incorporation of metal salts offers the opportu...
Amine-curing single-component epoxy resin adhesive compound on an epoxide base having the formula (I...
WO2005078036 A UPAB: 20051019 NOVELTY - Adhesive compositions (I) based on partly crystalline polyet...
Reaction of epoxy-diane resin with complex based on monoamide of phosphonic acid and ammonium chlori...
This work presents a straightforward strategy to introduce highly dynamic and adaptable cross-links ...
A method for the synthesis of an amine-containing epoxy resin curing agent by dissolving hexakis-[(4...
Epoxy adhesives are primarily composed of epoxy resin and curing agent. Epoxy adhesives are supplied...
Thermosettings polymers are materials with high thermal stability because of its tridimensional cros...
Solid, transparent epoxy-based nanocomposites with organophilic layered silicates as polymerisation ...