Integration eines Chips innerhalb einer Leiterplatte und integrierte Schaltung

DE 20021698 U UPAB: 20010628 NOVELTY - The integrated circuit includes a chip (1) without casing, and with at least one contact surface area (3) on its front side. A printed circuit board is provided with a floor layer (4) which comprises a dielectric layer (5) and a conductor structure (6). The chip is attached with its rear side on the floor layer, whereby no gap is provided for the chip in the dielectric layer. A further printed circuit board layer arranged on the floor layer encloses the chip. DETAILED DESCRIPTION - Extrusions extend through the further printed circuit board layer up to the connection surface area and the conductor structure, without extending through the chip. A contacting conductor structure is arranged on the further printed circuit board layer, extending up to the connection surface area and the conductor structure. USE - Integration of chips inside printed circuit board. ADVANTAGE - Enables high integration, and manufacture with existing processes and equipment