DE 10317827 A UPAB: 20050124 NOVELTY - The image sensing chip (2) is located behind a cover glass (3) on a base plate. The housing (6) for the lens (9), which is set into a holder (8), is secured to the base using fixing screws. When the screws are tightened the lens holder is clamped into position between an elastic 'O' ring (10) and a spacer tube (12). USE - Digital cameras. ADVANTAGE - Rapid signal acquisition and high sensitivity
DE1004003013 B UPAB: 20050621 NOVELTY - The imaging system has a regular array of optical channels p...
Today the development of industrial CMOS processes with respect to minimum structure size allows the...
DE 102005016818 A1 UPAB: 20061213 NOVELTY - The device has hole apertures (6) and detectors (7), and...
DE 102005040881 A1 UPAB: 20070608 NOVELTY - The device has a set of imaging sensor units (2) arrange...
NOVELTY - The image sensor element has a circuit part with a wiring part (400) occupying respective ...
WO2004001966 A UPAB: 20040213 NOVELTY - The sensor circuit has a sensor (S), a signal transmission d...
DE 102006059411 A1 UPAB: 20080715 NOVELTY - The method involves providing an optical transparent pla...
DE1004055677 A UPAB: 20060623 NOVELTY - The compound chip carrier structure has a semiconductor chip...
The presented High Dynamic Range CMOS image sensor was developed as part of an image processing syst...
DE 102009049387 A1 UPAB: 20110509 NOVELTY - The device (1000) has a micro-lens field (10) with two m...
DE 10064184 C UPAB: 20020502 NOVELTY - The imaging method has different output signal values provide...
DE 102006030273 A1 UPAB: 20080128 NOVELTY - The receiving device (180) has an optical inlet (110), a...
DE 102009007868 B3 UPAB: 20100527 NOVELTY - The system (22) has an imaging sensor (7) i.e. ultrasoni...
The optical detector includes at least one image sensor (10) which produces an output dependent on t...
DE 102009047361 A1 UPAB: 20110621 NOVELTY - The device has an optical channel (110) with imaging len...
DE1004003013 B UPAB: 20050621 NOVELTY - The imaging system has a regular array of optical channels p...
Today the development of industrial CMOS processes with respect to minimum structure size allows the...
DE 102005016818 A1 UPAB: 20061213 NOVELTY - The device has hole apertures (6) and detectors (7), and...
DE 102005040881 A1 UPAB: 20070608 NOVELTY - The device has a set of imaging sensor units (2) arrange...
NOVELTY - The image sensor element has a circuit part with a wiring part (400) occupying respective ...
WO2004001966 A UPAB: 20040213 NOVELTY - The sensor circuit has a sensor (S), a signal transmission d...
DE 102006059411 A1 UPAB: 20080715 NOVELTY - The method involves providing an optical transparent pla...
DE1004055677 A UPAB: 20060623 NOVELTY - The compound chip carrier structure has a semiconductor chip...
The presented High Dynamic Range CMOS image sensor was developed as part of an image processing syst...
DE 102009049387 A1 UPAB: 20110509 NOVELTY - The device (1000) has a micro-lens field (10) with two m...
DE 10064184 C UPAB: 20020502 NOVELTY - The imaging method has different output signal values provide...
DE 102006030273 A1 UPAB: 20080128 NOVELTY - The receiving device (180) has an optical inlet (110), a...
DE 102009007868 B3 UPAB: 20100527 NOVELTY - The system (22) has an imaging sensor (7) i.e. ultrasoni...
The optical detector includes at least one image sensor (10) which produces an output dependent on t...
DE 102009047361 A1 UPAB: 20110621 NOVELTY - The device has an optical channel (110) with imaging len...
DE1004003013 B UPAB: 20050621 NOVELTY - The imaging system has a regular array of optical channels p...
Today the development of industrial CMOS processes with respect to minimum structure size allows the...
DE 102005016818 A1 UPAB: 20061213 NOVELTY - The device has hole apertures (6) and detectors (7), and...