With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their broad application in a variety of market segments new reliability issues will arise. The increasing interface-to-volume ratio in highly integrated systems and nanoparticle filled materials and unsolved questions of size effect of nanomaterials are challenges for experimental reliability evaluation. Therefore the authors developed the nanoDAC method (nano Deformation Analysis by Correlation), which allows the determination and evaluation of 2D displacement fields based on Scanning Probe Microscopy (SPM) data. In-situ SPM scans of the analyzed object are carried out at different thermomechanical load states. The images are compared utilizing gra...
Micro machined micro sensors for gas or flow detection based on physical behaviour of a special laye...
The mechanical testing of micro-electro-mechanical systems (MEMS) and nano-electro-mechanical system...
Design, manufacturing and packaging of new MEMS/NEMS devices demands detailed know-how on mechanical...
With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their b...
With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their b...
Recent advances in microtechnology and the development of new electronics and micro/nanosystem devic...
Recent advances in microtechnology and the development of new electronics and micro/nanosystem devic...
Proceeding progress in miniaturization of electronic packages results in the need for experimental m...
With the development and application of micro/nano electronic mechanical systems (MEMS, NEMS) for a ...
This thesis comprises the development, accuracy testing and application of the so-called nanoDAC met...
The rapid development of a wide variety of new devises in microelectronics, MEMS, NEMS and nano tech...
The paper presents a new reliability approach based on local stress and deformation analysis by mean...
Recent advances in microelectronics and electronic packaging technology have led to a strong need in...
The authors present a new approach to deformation analysis based on localized correlation analysis o...
Thermo-mechanical reliability in advanced electronic, MEMS and MOEMS packaging requires additional m...
Micro machined micro sensors for gas or flow detection based on physical behaviour of a special laye...
The mechanical testing of micro-electro-mechanical systems (MEMS) and nano-electro-mechanical system...
Design, manufacturing and packaging of new MEMS/NEMS devices demands detailed know-how on mechanical...
With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their b...
With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their b...
Recent advances in microtechnology and the development of new electronics and micro/nanosystem devic...
Recent advances in microtechnology and the development of new electronics and micro/nanosystem devic...
Proceeding progress in miniaturization of electronic packages results in the need for experimental m...
With the development and application of micro/nano electronic mechanical systems (MEMS, NEMS) for a ...
This thesis comprises the development, accuracy testing and application of the so-called nanoDAC met...
The rapid development of a wide variety of new devises in microelectronics, MEMS, NEMS and nano tech...
The paper presents a new reliability approach based on local stress and deformation analysis by mean...
Recent advances in microelectronics and electronic packaging technology have led to a strong need in...
The authors present a new approach to deformation analysis based on localized correlation analysis o...
Thermo-mechanical reliability in advanced electronic, MEMS and MOEMS packaging requires additional m...
Micro machined micro sensors for gas or flow detection based on physical behaviour of a special laye...
The mechanical testing of micro-electro-mechanical systems (MEMS) and nano-electro-mechanical system...
Design, manufacturing and packaging of new MEMS/NEMS devices demands detailed know-how on mechanical...