The present paper reports on the local atmospheric pressure plasma pretreatment of polymeric substrates for a subsequent metallization by electroless nickel and copper electrolytes, respectively. Plasma-assisted deposition from aminopropyl-trimethoxysilane monomer using dielectric barrier microdischarges is used to prepare surfaces containing amino groups which have a strong tendency to bind Pd2+. The adsorbed palladium ions are reduced to metallic Pd nanoparticles serving as seeds for the autocatalytic metallization with Cu and Ni, respectively. The treated polymer has been characterized by fluorescence labeling with fluoresceine-isothiocyanate or fluorescamine. The adhesion of the thin metal films to the polymeric surface is usually suffi...
We present new electroless palladium plating reactions, which can be applied to complex-shaped subst...
Results of the work to develop a new potentially cost-efficient reel-to-reel technology for the prod...
Combination of polymeric and metallic layers in a single device is becoming inevitable for applicati...
An environmentally friendly plasma amination process for the activation of polymers prior to electro...
The conventional pretreatment of polymers for lthe metallization by electroplating is based on hazar...
A new plasma-chemical micro-patterning technique, here referred to as Plasma Printing, combines the ...
Using dielectric barrier discharges (DBDs) in suitable gas atmospheres, appreciable densities of ami...
A new plasma-based micropatterning technique, here referred to as plasma printing, combines the well...
International audienceA new efficient approach for selective metallization of flexible substrates su...
This paper reports on the plasma polymerization of amine-containing films from 3-aminopropyl trimeth...
Pulsed plasma polymerization provides a highly efficient, single step, solventless method of surface...
Electroless metallization of polymers requires dierent steps including (i) the preconditioning of th...
Les dispositifs interconnectés moulés (« Molded Interconnected Devices », MID) sont constitués de su...
International audienceThe "3D amino-induced electroless plating" (3D-AIEP) process is an easy and co...
Atmospheric-pressure plasma processes based on dielectric barrier discharges (DBD) using air as proc...
We present new electroless palladium plating reactions, which can be applied to complex-shaped subst...
Results of the work to develop a new potentially cost-efficient reel-to-reel technology for the prod...
Combination of polymeric and metallic layers in a single device is becoming inevitable for applicati...
An environmentally friendly plasma amination process for the activation of polymers prior to electro...
The conventional pretreatment of polymers for lthe metallization by electroplating is based on hazar...
A new plasma-chemical micro-patterning technique, here referred to as Plasma Printing, combines the ...
Using dielectric barrier discharges (DBDs) in suitable gas atmospheres, appreciable densities of ami...
A new plasma-based micropatterning technique, here referred to as plasma printing, combines the well...
International audienceA new efficient approach for selective metallization of flexible substrates su...
This paper reports on the plasma polymerization of amine-containing films from 3-aminopropyl trimeth...
Pulsed plasma polymerization provides a highly efficient, single step, solventless method of surface...
Electroless metallization of polymers requires dierent steps including (i) the preconditioning of th...
Les dispositifs interconnectés moulés (« Molded Interconnected Devices », MID) sont constitués de su...
International audienceThe "3D amino-induced electroless plating" (3D-AIEP) process is an easy and co...
Atmospheric-pressure plasma processes based on dielectric barrier discharges (DBD) using air as proc...
We present new electroless palladium plating reactions, which can be applied to complex-shaped subst...
Results of the work to develop a new potentially cost-efficient reel-to-reel technology for the prod...
Combination of polymeric and metallic layers in a single device is becoming inevitable for applicati...