Add to ORKGThe impact of stacked 3D-packages in PCB-technology has considerably increased over the past few years. COB (Chip on Board), CSP (Chip Sized Packages) or flip-chip technologies may not meet all the demands of highly integrated or space-limited applications. The 3D-packaging technology makes it possible to stack the PCBs on top of each other and thus make full use of the third dimension. Taking full advantage of the modularisation possibili-ties of 3D-packages (Match-X) can give the competitive edge particularly to small and me-dium-sized companies
This paper reviews the state-of-the-art in VLSI 3D packaging technology with a view to compact porta...
The electronic industry is reducing package dimensions of components as well as complete electronics...
A 3D-packaging technology is developed which focuses on stacking and interconnecting multiple thinne...
The importance of 3D packages with standardized interfaces has increased continually over the past y...
Die ständig zunehmenden Miniaturisierungen und hohen Integrationsdichten, führten in den letzten Jah...
Die Integration multifunktionaler hybrider Systeme erfordern Packaging-Technologien, mit denen hochp...
High integrated printed circuit boards (PCB) for high power applications needs new cooling concepts....
High integrated electronic PCB boards for high power applications needs new cooling Concepts. The 3D...
In order to increase the functionality of electronic devices, while reducing the overall size and we...
Printed circuit boards (PCBs) have been the basis for all electronic applications of the past and wi...
The technology will be demonstrated with a miniaturized 3/2-way valve in a 3D-package. With the sold...
Several new technologies for the production of 3D-packages in HDI (High Density Integration) are dis...
This paper reviews the state-of-the-art in three-dimensional (3-D) packaging technology for very lar...
In this paper the realization of packages and System-in-Packages (SIP) with embedded components will...
Within the scope of the R and D-project 'Techniques of higher integration levels' the following acti...
This paper reviews the state-of-the-art in VLSI 3D packaging technology with a view to compact porta...
The electronic industry is reducing package dimensions of components as well as complete electronics...
A 3D-packaging technology is developed which focuses on stacking and interconnecting multiple thinne...
The importance of 3D packages with standardized interfaces has increased continually over the past y...
Die ständig zunehmenden Miniaturisierungen und hohen Integrationsdichten, führten in den letzten Jah...
Die Integration multifunktionaler hybrider Systeme erfordern Packaging-Technologien, mit denen hochp...
High integrated printed circuit boards (PCB) for high power applications needs new cooling concepts....
High integrated electronic PCB boards for high power applications needs new cooling Concepts. The 3D...
In order to increase the functionality of electronic devices, while reducing the overall size and we...
Printed circuit boards (PCBs) have been the basis for all electronic applications of the past and wi...
The technology will be demonstrated with a miniaturized 3/2-way valve in a 3D-package. With the sold...
Several new technologies for the production of 3D-packages in HDI (High Density Integration) are dis...
This paper reviews the state-of-the-art in three-dimensional (3-D) packaging technology for very lar...
In this paper the realization of packages and System-in-Packages (SIP) with embedded components will...
Within the scope of the R and D-project 'Techniques of higher integration levels' the following acti...
This paper reviews the state-of-the-art in VLSI 3D packaging technology with a view to compact porta...
The electronic industry is reducing package dimensions of components as well as complete electronics...
A 3D-packaging technology is developed which focuses on stacking and interconnecting multiple thinne...