DE1004055677 A UPAB: 20060623 NOVELTY - The compound chip carrier structure has a semiconductor chip (1) which has two surfaces (2c,2d) and two contact zones (2a,2b) at the first surface. The bonded carrier substrate (7) with two surfaces (7a,7b) and two electrically conductive contact zones (8a,8b) passing through the substrate, between its surfaces. USE - The compound chip structure is for opto-electronic image converters, especially for military applications in night sights or residual light amplification. ADVANTAGE - The structure gives an image sensor with high precision or a high frequency circuit with high sensitivity and temperature stability with vacuum suitability
WO 200219403 A UPAB: 20020704 NOVELTY - Production of a composite structure comprises preparing a gr...
DE 19840210 A UPAB: 20000502 NOVELTY - The integrated circuit (IC) chips (8) are arranged in a first...
DE 19848821 C UPAB: 20000712 NOVELTY - The process involves producing a carrier substrate (16) with ...
Chip carrier arrangement (23) comprising a chip carrier (23) for the production of a chip housing, s...
DE 19845296 A UPAB: 20000524 NOVELTY - The method involves contacting a chip (2) which comprises at ...
The chip module (20) has at least one chip (22) attached to a chip carrier (21) provided by a foil a...
WO 2008031609 A1 UPAB: 20080403 NOVELTY - The module has two carrier plates (11, 22) that are arrang...
A chip arrangement has a connection system consisting of several individual spaced diamond pieces (1...
NOVELTY - A semiconductor component is produced by forming conductive vias through the component lay...
DE 10317827 A UPAB: 20050124 NOVELTY - The image sensing chip (2) is located behind a cover glass (3...
WO 9811506 A UPAB: 19980520 A smart card has an embedded integrated circuit module (12) that is moun...
DE 102006059411 A1 UPAB: 20080715 NOVELTY - The method involves providing an optical transparent pla...
Known chip devices are produced by coating plastic substrates. The substrate material is brittle and...
DE 102007009383 A1 UPAB: 20080912 NOVELTY - The arrangement has an integrated circuit (2) arranged o...
DE 102007005234 A1 UPAB: 20080815 NOVELTY - The electronic module (1) has a semiconductor chip (2) e...
WO 200219403 A UPAB: 20020704 NOVELTY - Production of a composite structure comprises preparing a gr...
DE 19840210 A UPAB: 20000502 NOVELTY - The integrated circuit (IC) chips (8) are arranged in a first...
DE 19848821 C UPAB: 20000712 NOVELTY - The process involves producing a carrier substrate (16) with ...
Chip carrier arrangement (23) comprising a chip carrier (23) for the production of a chip housing, s...
DE 19845296 A UPAB: 20000524 NOVELTY - The method involves contacting a chip (2) which comprises at ...
The chip module (20) has at least one chip (22) attached to a chip carrier (21) provided by a foil a...
WO 2008031609 A1 UPAB: 20080403 NOVELTY - The module has two carrier plates (11, 22) that are arrang...
A chip arrangement has a connection system consisting of several individual spaced diamond pieces (1...
NOVELTY - A semiconductor component is produced by forming conductive vias through the component lay...
DE 10317827 A UPAB: 20050124 NOVELTY - The image sensing chip (2) is located behind a cover glass (3...
WO 9811506 A UPAB: 19980520 A smart card has an embedded integrated circuit module (12) that is moun...
DE 102006059411 A1 UPAB: 20080715 NOVELTY - The method involves providing an optical transparent pla...
Known chip devices are produced by coating plastic substrates. The substrate material is brittle and...
DE 102007009383 A1 UPAB: 20080912 NOVELTY - The arrangement has an integrated circuit (2) arranged o...
DE 102007005234 A1 UPAB: 20080815 NOVELTY - The electronic module (1) has a semiconductor chip (2) e...
WO 200219403 A UPAB: 20020704 NOVELTY - Production of a composite structure comprises preparing a gr...
DE 19840210 A UPAB: 20000502 NOVELTY - The integrated circuit (IC) chips (8) are arranged in a first...
DE 19848821 C UPAB: 20000712 NOVELTY - The process involves producing a carrier substrate (16) with ...
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