DE 102005008281 A1 UPAB: 20061005 NOVELTY - The method involves local material manipulation on the body which leads to redistribution of stress or expansion behavior. A recording of the surface area of the body treated is made before and after the manipulation. A comparison of the recordings is used to determine deformation fields caused by residual stress. The local residual stress can be derived from these fields. The manipulation is carried out with an ion beam (12) which generates a structure with dimensions in the micro or nanometer range in or on the body. The recordings are microscopic recordings. USE - In manufacturing microelectronic or micromechanical components. ADVANTAGE - Can be easily used in the micro and nanometer ranges
In the present paper we consider two representative methods for residual stress evaluation at the mi...
The authors present a digital image correlation (DIC) tool, which allows to measure deformation fiel...
Design, manufacturing and packaging of new MEMS/NEMS devices demands detailed know-how on mechanical...
The paper comprises research results obtained for stress determination on micro and nanotechnology c...
Research results obtained for local stress determination on micro and nanotechnology components are ...
The use of a focused ion beam equipment is reported to find out the in-plane residual stress value o...
Integration of micro and nano devices causes several new reliability issues to be analyzed and solve...
A new approach to the local measurement of residual stress in microstructures is described in this p...
A new approach to the local measurement of residual stress in microstructures is described in this p...
The paper presents a recently developed method of measuring frozen elastic stresses in micro compone...
Residual stresses in semiconductor and MEMS devices superposing functional and environmental loading...
In this paper, a new approach is presented for local residual stress measurement in MEMS structures....
"Residual stress evaluation in thin films at the sub-micron scale was achieved in the present study ...
Analysis and control of residual stresses in advanced engineering materials are important issues for...
In the present paper we consider two representative methods for residual stress evaluation at the mi...
In the present paper we consider two representative methods for residual stress evaluation at the mi...
The authors present a digital image correlation (DIC) tool, which allows to measure deformation fiel...
Design, manufacturing and packaging of new MEMS/NEMS devices demands detailed know-how on mechanical...
The paper comprises research results obtained for stress determination on micro and nanotechnology c...
Research results obtained for local stress determination on micro and nanotechnology components are ...
The use of a focused ion beam equipment is reported to find out the in-plane residual stress value o...
Integration of micro and nano devices causes several new reliability issues to be analyzed and solve...
A new approach to the local measurement of residual stress in microstructures is described in this p...
A new approach to the local measurement of residual stress in microstructures is described in this p...
The paper presents a recently developed method of measuring frozen elastic stresses in micro compone...
Residual stresses in semiconductor and MEMS devices superposing functional and environmental loading...
In this paper, a new approach is presented for local residual stress measurement in MEMS structures....
"Residual stress evaluation in thin films at the sub-micron scale was achieved in the present study ...
Analysis and control of residual stresses in advanced engineering materials are important issues for...
In the present paper we consider two representative methods for residual stress evaluation at the mi...
In the present paper we consider two representative methods for residual stress evaluation at the mi...
The authors present a digital image correlation (DIC) tool, which allows to measure deformation fiel...
Design, manufacturing and packaging of new MEMS/NEMS devices demands detailed know-how on mechanical...