WO 2007113325 A1 UPAB: 20071121 NOVELTY - The multiple-component has a flat substrate and a flat cap structure connected with each other in such a manner that the flat substrate and the flat cap structure surround two cavities (5, 6) for respective component parts e.g. chips, where the cavities are sealed against each other and towards an outer environment. The cavity (5) is provided with getter material (8), where the cavity (5) exhibits a different internal pressure and/or a different gas composition from the cavity (6) due to the getter material. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for the following: (1) a flat substrate and a flat cap structure for utilization in a multiple-component (2) a component part with a f...
WO 2010085942 A2 UPAB: 20100825 NOVELTY - The microstructure (10) has a bonding substrate (1) and a ...
A method for manufacturing a multi-material component, including manufacturing a part with at least ...
NOVELTY - The microsystem has a flexible foil (12), a number of semiconducting elements (14) embedde...
WO 200036385 A UPAB: 20000811 NOVELTY - Micromechanical structure production involves bonding a firs...
DE 102006042764 B3 UPAB: 20080604 NOVELTY - The wafer (1) has multiple gas absorption arrays (2) tha...
In an apparatus (10) for separate encapsulation of several identical or different materials in close...
WO 2008087022 A1 UPAB: 20080806 NOVELTY - The housing has a carrier wafer (1) with a micro-mechanica...
NOVELTY - A semiconductor component is produced by forming conductive vias through the component lay...
NOVELTY - At least one component is located and contacted on the first region (102) of the substrate...
DE 102006014317 A1 UPAB: 20080221 NOVELTY - The method for the manufacture of micro-reactor or micro...
WO 2010094511 A2 UPAB: 20100910 NOVELTY - The method for the production of component arrangement (10...
WO2003089129 A UPAB: 20031203 NOVELTY - The integrated mixing and switching system, for micro-reacto...
The semiconductor substrate (1) has a reactive multi-layer (7) that react exothermically with two al...
A blending system incorporating a blender with an operating cavity housing a plurality of elongate r...
A component (100) is bonded to a substrate (102) by solder (110) while the component is positioned a...
WO 2010085942 A2 UPAB: 20100825 NOVELTY - The microstructure (10) has a bonding substrate (1) and a ...
A method for manufacturing a multi-material component, including manufacturing a part with at least ...
NOVELTY - The microsystem has a flexible foil (12), a number of semiconducting elements (14) embedde...
WO 200036385 A UPAB: 20000811 NOVELTY - Micromechanical structure production involves bonding a firs...
DE 102006042764 B3 UPAB: 20080604 NOVELTY - The wafer (1) has multiple gas absorption arrays (2) tha...
In an apparatus (10) for separate encapsulation of several identical or different materials in close...
WO 2008087022 A1 UPAB: 20080806 NOVELTY - The housing has a carrier wafer (1) with a micro-mechanica...
NOVELTY - A semiconductor component is produced by forming conductive vias through the component lay...
NOVELTY - At least one component is located and contacted on the first region (102) of the substrate...
DE 102006014317 A1 UPAB: 20080221 NOVELTY - The method for the manufacture of micro-reactor or micro...
WO 2010094511 A2 UPAB: 20100910 NOVELTY - The method for the production of component arrangement (10...
WO2003089129 A UPAB: 20031203 NOVELTY - The integrated mixing and switching system, for micro-reacto...
The semiconductor substrate (1) has a reactive multi-layer (7) that react exothermically with two al...
A blending system incorporating a blender with an operating cavity housing a plurality of elongate r...
A component (100) is bonded to a substrate (102) by solder (110) while the component is positioned a...
WO 2010085942 A2 UPAB: 20100825 NOVELTY - The microstructure (10) has a bonding substrate (1) and a ...
A method for manufacturing a multi-material component, including manufacturing a part with at least ...
NOVELTY - The microsystem has a flexible foil (12), a number of semiconducting elements (14) embedde...