Micro machined micro sensors for gas or flow detection based on physical behaviour of a special layer of a membrane have to fulfil high quality and reliability requirements especially in safety or security applications. Up to now, most of the research studies neglected mechanical issues related to reliability of these structures. In this sense, the study and characterization of the stress distribution on the membranes after fabrication and during their operative life is required. Thin films used in micromachined structures exhibit residual mechanical stress strongly dependent on the layer composition and the deposition process parameters. Often, a deposition of a multilayer is required, and this adds factors like abrupt transitions in therm...
New challenges for design, manufacturing and packaging of MEMS/NEMS arise from the ongoing miniaturi...
Integration of micro and nano devices causes several new reliability issues to be analyzed and solve...
The residual stress of thin films during the deposition process can cause the components to have unp...
Micromachined microsensors for gas or flow detection based on physical behaviour of a special layer ...
Recent advances in microtechnology and the development of new electronics and micro/nanosystem devic...
The paper comprises research results obtained for stress determination on micro and nanotechnology c...
Recent advances in microtechnology and the development of new electronics and micro/nanosystem devic...
Research results obtained for local stress determination on micro and nanotechnology components are ...
A new approach to the local measurement of residual stress in microstructures is described in this p...
A new approach to the local measurement of residual stress in microstructures is described in this p...
With the development and application of micro/nano electronic mechanical systems (MEMS, NEMS) for a ...
With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their b...
The rapid development of a wide variety of new devises in microelectronics, MEMS, NEMS and nano tech...
The authors present a digital image correlation (DIC) tool, which allows to measure deformation fiel...
Design, manufacturing and packaging of new MEMS/NEMS devices demands detailed know-how on mechanical...
New challenges for design, manufacturing and packaging of MEMS/NEMS arise from the ongoing miniaturi...
Integration of micro and nano devices causes several new reliability issues to be analyzed and solve...
The residual stress of thin films during the deposition process can cause the components to have unp...
Micromachined microsensors for gas or flow detection based on physical behaviour of a special layer ...
Recent advances in microtechnology and the development of new electronics and micro/nanosystem devic...
The paper comprises research results obtained for stress determination on micro and nanotechnology c...
Recent advances in microtechnology and the development of new electronics and micro/nanosystem devic...
Research results obtained for local stress determination on micro and nanotechnology components are ...
A new approach to the local measurement of residual stress in microstructures is described in this p...
A new approach to the local measurement of residual stress in microstructures is described in this p...
With the development and application of micro/nano electronic mechanical systems (MEMS, NEMS) for a ...
With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their b...
The rapid development of a wide variety of new devises in microelectronics, MEMS, NEMS and nano tech...
The authors present a digital image correlation (DIC) tool, which allows to measure deformation fiel...
Design, manufacturing and packaging of new MEMS/NEMS devices demands detailed know-how on mechanical...
New challenges for design, manufacturing and packaging of MEMS/NEMS arise from the ongoing miniaturi...
Integration of micro and nano devices causes several new reliability issues to be analyzed and solve...
The residual stress of thin films during the deposition process can cause the components to have unp...