.In this work, we have investigated three different surface passivation technologies: classical thermal oxidation (CTO), rapid thermal oxidation (RTO) and silicon nitride by plasma enhanced chemical vapor deposition (PECVD). Eight different passivation properties including SiO2/SiNx stacks on phosphorus diffused (100 and 40 ohm/Sq) and non-diffused 1 ohm cm FZ silicon were compared. Both types Of SiO2 layers, CTO and RTO, yield a higher effective lifetime on the emitter surface than on the non-diffused surface. For the SiNx layers the situation is reverted. On the other hand, with SiO2/SiNx stacks high lifetimes are obtained not only non-diffused surface but also on the diffused surface. Thus, we have chosen the RTO/SiNx stack layers as fro...
Passivation of the crystalline silicon surface is central to the attainment of high-efficiency silic...
By comparison of simultaneously processed solar cells, bifacial cells and contactless photoconductiv...
It is difficult to deposit extremely thin a-Si:H layer in heterojunction with intrinsic thin layer (...
In this work, three different surface passivation technologies are used: classical thermal oxidation...
Two different techniques for the electronic surface passivation of silicon solar cells, the plasma-e...
Presented at the 2nd World Conference on Photovoltaic Solar Energy Conversion; Vienna, Austria; July...
A novel stack passivation scheme, in which plasma silicon nitride (SiN) is stacked on top of a rapid...
Passivation of silicon surfaces remains a critical factor in achieving high conversion efficiency in...
In this work we investigated the properties of silicon oxide (SiOy) and silicon nitride (SiNx) layer...
The emitter saturation current density (Joe) of various high quality passivation schemes on phosphor...
High-efficiency silicon solar cells strongly rely on an effective reduction of charge carrier recomb...
Surface passivation stack systems, all deposited using PECVD, are investigated. Stacks of SiOx, SiNx...
Plasma-enhanced chemical vapour deposited (PECVD) amorphous silicon nitride films (SiNx) are well kn...
This thesis considers the optimisation of an SiO2-SiNx-SiOx (ONO) dielectric coating for silicon sol...
Passivation of the crystalline silicon surface is central to the attainment of high-efficiency silic...
Passivation of the crystalline silicon surface is central to the attainment of high-efficiency silic...
By comparison of simultaneously processed solar cells, bifacial cells and contactless photoconductiv...
It is difficult to deposit extremely thin a-Si:H layer in heterojunction with intrinsic thin layer (...
In this work, three different surface passivation technologies are used: classical thermal oxidation...
Two different techniques for the electronic surface passivation of silicon solar cells, the plasma-e...
Presented at the 2nd World Conference on Photovoltaic Solar Energy Conversion; Vienna, Austria; July...
A novel stack passivation scheme, in which plasma silicon nitride (SiN) is stacked on top of a rapid...
Passivation of silicon surfaces remains a critical factor in achieving high conversion efficiency in...
In this work we investigated the properties of silicon oxide (SiOy) and silicon nitride (SiNx) layer...
The emitter saturation current density (Joe) of various high quality passivation schemes on phosphor...
High-efficiency silicon solar cells strongly rely on an effective reduction of charge carrier recomb...
Surface passivation stack systems, all deposited using PECVD, are investigated. Stacks of SiOx, SiNx...
Plasma-enhanced chemical vapour deposited (PECVD) amorphous silicon nitride films (SiNx) are well kn...
This thesis considers the optimisation of an SiO2-SiNx-SiOx (ONO) dielectric coating for silicon sol...
Passivation of the crystalline silicon surface is central to the attainment of high-efficiency silic...
Passivation of the crystalline silicon surface is central to the attainment of high-efficiency silic...
By comparison of simultaneously processed solar cells, bifacial cells and contactless photoconductiv...
It is difficult to deposit extremely thin a-Si:H layer in heterojunction with intrinsic thin layer (...