DE 102006019080 B3 UPAB: 20070927 NOVELTY - The method involves providing a substrate, where an electrical circuit enclosing a metal frame (104a, 104b) is produced on a surface of the substrate. Another substrate is connected with another metal frame (106a, 106b), where a surface of the latter substrate is smaller than the surface of the former substrate. The circuit is isolated along an isolating contour that does not cut the surface of the latter substrate. USE - Used for manufacturing a housing with an electrical circuit, where the housing is utilized for electrical, optical, micromechanical, and other component e.g. infrared sensor for infrared camera, thermal image camera or image receiver for a night vision device, gyroscope, and an e...
WO 200122492 A UPAB: 20010704 NOVELTY - The method involves forming a first set of micro-functional ...
A component (100) is bonded to a substrate (102) by solder (110) while the component is positioned a...
DE 102007013329 A1 UPAB: 20081018 NOVELTY - The method involves applying a conductive strip plane (1...
DE 202006006610 U1 UPAB: 20061129 NOVELTY - The housing has a substrate with an electrical circuit, ...
DE 102007010711 A1 UPAB: 20080925 NOVELTY - The circuit arrangement has a substrate (1), a microelec...
WO 2010094511 A2 UPAB: 20100910 NOVELTY - The method for the production of component arrangement (10...
DE 102006059411 A1 UPAB: 20080715 NOVELTY - The method involves providing an optical transparent pla...
DE 102006044525 B3 UPAB: 20080310 NOVELTY - The method involves continuous making of a flexible subs...
DE 102008022733 A1 UPAB: 20091130 NOVELTY - The unit has active or passive electronic components i.e...
WO 2007025753 A2 UPAB: 20070629 NOVELTY - The method involves producing two functional layers (12a-1...
DE 102010005465 A1 UPAB: 20100915 NOVELTY - The component (1) has a protective layer (4) arranged on...
WO 2008087022 A1 UPAB: 20080806 NOVELTY - The housing has a carrier wafer (1) with a micro-mechanica...
DE 102005039068 A1 UPAB: 20070402 NOVELTY - A semiconductor substrate comprises electrical connectio...
DE 102007039754 A1 UPAB: 20090114 NOVELTY - The method involves guiding a connection of a front side...
EP 2257148 A2 UPAB: 20101208 NOVELTY - The housing (10) has a housing wall (11) partially provided w...
WO 200122492 A UPAB: 20010704 NOVELTY - The method involves forming a first set of micro-functional ...
A component (100) is bonded to a substrate (102) by solder (110) while the component is positioned a...
DE 102007013329 A1 UPAB: 20081018 NOVELTY - The method involves applying a conductive strip plane (1...
DE 202006006610 U1 UPAB: 20061129 NOVELTY - The housing has a substrate with an electrical circuit, ...
DE 102007010711 A1 UPAB: 20080925 NOVELTY - The circuit arrangement has a substrate (1), a microelec...
WO 2010094511 A2 UPAB: 20100910 NOVELTY - The method for the production of component arrangement (10...
DE 102006059411 A1 UPAB: 20080715 NOVELTY - The method involves providing an optical transparent pla...
DE 102006044525 B3 UPAB: 20080310 NOVELTY - The method involves continuous making of a flexible subs...
DE 102008022733 A1 UPAB: 20091130 NOVELTY - The unit has active or passive electronic components i.e...
WO 2007025753 A2 UPAB: 20070629 NOVELTY - The method involves producing two functional layers (12a-1...
DE 102010005465 A1 UPAB: 20100915 NOVELTY - The component (1) has a protective layer (4) arranged on...
WO 2008087022 A1 UPAB: 20080806 NOVELTY - The housing has a carrier wafer (1) with a micro-mechanica...
DE 102005039068 A1 UPAB: 20070402 NOVELTY - A semiconductor substrate comprises electrical connectio...
DE 102007039754 A1 UPAB: 20090114 NOVELTY - The method involves guiding a connection of a front side...
EP 2257148 A2 UPAB: 20101208 NOVELTY - The housing (10) has a housing wall (11) partially provided w...
WO 200122492 A UPAB: 20010704 NOVELTY - The method involves forming a first set of micro-functional ...
A component (100) is bonded to a substrate (102) by solder (110) while the component is positioned a...
DE 102007013329 A1 UPAB: 20081018 NOVELTY - The method involves applying a conductive strip plane (1...