In this work, we introduce a high voltage 3D-capacitor as a novel passive power device for a 400 V application. This device is realized in silicon technology which allows process reproducibility, high accuracy in capacitance values, and high quality of the dielectric layers (i.e., endurance at high electric field strengths). It can be manufactured discrete or as part of a monolithic integrated circuit. The outstanding properties of the device are a high ratio of capacitance value to consumed silicon area (capacitance enlargement of more than a factor of 16 in comparison to plane capacitors) and very stable capacitance values over a broad temperature range (i.e., average of 24 ppm/°C from 20-175°C)
This paper presents a novel technique for the fabrication of ultrahigh capacitance structures based ...
\u3cp\u3eLast decades great effort has been put in the development of 3D capacitors. These capacitor...
This thesis explores high voltage converter circuits for MEMS applications using micromachined devic...
In this work, we introduce a high voltage 3D-capacitor as a novel passive power device for a 400V ap...
In this work, high-voltage monolithic 3D capacitors operating at 100 V (6 MV/cm) are fabricated by t...
This paper focuses on the scaling and optimization of metal-isolator-metal capacitors integrated in ...
The increasing request of on-chip energy storage devices is driven by the augmented connectivity bet...
International audienceThis paper presents the state of the art technologies currently used to produc...
The currently growing request for a continuous connectivity between people and things has increased ...
Capacitors are the most critical passive components of future in-package and on-chip electronic syst...
Passive components like capacitors for harsh environments become more and more important, e. g. in t...
This paper focuses on zirconia and TiN based metal-isolator-metal capacitors integrated in immediate...
This work presents the design and test of a switched-cap 3D DC/DC converter able to work up to 60V. ...
This work presents the design and test of a switched-cap 3D DC/DC converter able to work up to 60V. ...
The concept of 3D capacitor embedded in TSV has been proposed recently to achieve ultrahigh capacita...
This paper presents a novel technique for the fabrication of ultrahigh capacitance structures based ...
\u3cp\u3eLast decades great effort has been put in the development of 3D capacitors. These capacitor...
This thesis explores high voltage converter circuits for MEMS applications using micromachined devic...
In this work, we introduce a high voltage 3D-capacitor as a novel passive power device for a 400V ap...
In this work, high-voltage monolithic 3D capacitors operating at 100 V (6 MV/cm) are fabricated by t...
This paper focuses on the scaling and optimization of metal-isolator-metal capacitors integrated in ...
The increasing request of on-chip energy storage devices is driven by the augmented connectivity bet...
International audienceThis paper presents the state of the art technologies currently used to produc...
The currently growing request for a continuous connectivity between people and things has increased ...
Capacitors are the most critical passive components of future in-package and on-chip electronic syst...
Passive components like capacitors for harsh environments become more and more important, e. g. in t...
This paper focuses on zirconia and TiN based metal-isolator-metal capacitors integrated in immediate...
This work presents the design and test of a switched-cap 3D DC/DC converter able to work up to 60V. ...
This work presents the design and test of a switched-cap 3D DC/DC converter able to work up to 60V. ...
The concept of 3D capacitor embedded in TSV has been proposed recently to achieve ultrahigh capacita...
This paper presents a novel technique for the fabrication of ultrahigh capacitance structures based ...
\u3cp\u3eLast decades great effort has been put in the development of 3D capacitors. These capacitor...
This thesis explores high voltage converter circuits for MEMS applications using micromachined devic...