Assembly of ASICs for high temperature applications - material characterization and reliability testing

Fast decrease of device dimensions, rapid growth of the number of elements per integrated circuit device (IC) and the increasing amount of interconnections between the chip and the substrate lead to a more complex design and production of the ICs and to higher demands towards packaging technology as well. Within automotive, geothermal wells, nuclear power, aerospace and space applications high temperature devices operate between 150°C to 600°C. We present an approach for both the adhesive and the encapsulant for packaging of high temperature ICs. First capacitive pressure sensors and EEPROMs have been successfully assembled by this technique