In this study, a technology-oriented simplified mechanical fatigue testing approach for aluminium heavy wire bonds as well as first experimental results are presented. In the test setup, bonding wires were displacement-controlled loaded with different amplitudes at room temperature and the corresponding cycles to failure were experimentally determined. Loop geometries were varied in a technological meaningful range. The experimentally determined endurance curves show a strong influence of the bonding geometry on the lifetime of the bonding wires. In addition to testing, a three dimensional finite element model of the different bonding wire geometries was developed in order to quantify the local deformation situation at the failure site in t...
Electrical signal transmission in power electronic devices takes place through high-purity aluminum ...
In power electronic devices the electrical connections of different components are mainly realized b...
In power electronic devices the electrical connections of different components are mainly realized b...
This paper develops a lifetime prediction model for thick aluminium wire bonds from purest (99.999%)...
Aluminum wire bonds, as used in a ceramic air cavity package for LDMOS, will intrinsically be prone ...
Purpose - The purpose of this paper is to establish a law on the durability of thick aluminium wire ...
Bonding wires made of aluminum are the most used materials for the transmission of electrical signal...
Bonding wires made of aluminum are the most used materials for the transmission of electrical signal...
The reliability of power electronic devices is mainly limited due to thermo-mechanical fatigue of th...
The subject of this study was to investigate the effect of different geometrical loop shapes on the ...
In this study a high frequency mechanical fatigue testing procedure for evaluation of interfacial re...
Development of advanced electronic packages can be drastically affected by implementation of new mat...
Every new development in device performance and packaging design, can drastically affect the reliabi...
Electrical signal transmission in power electronic devices takes place through high-purity aluminum ...
Electrical signal transmission in power electronic devices takes place through high-purity aluminum ...
Electrical signal transmission in power electronic devices takes place through high-purity aluminum ...
In power electronic devices the electrical connections of different components are mainly realized b...
In power electronic devices the electrical connections of different components are mainly realized b...
This paper develops a lifetime prediction model for thick aluminium wire bonds from purest (99.999%)...
Aluminum wire bonds, as used in a ceramic air cavity package for LDMOS, will intrinsically be prone ...
Purpose - The purpose of this paper is to establish a law on the durability of thick aluminium wire ...
Bonding wires made of aluminum are the most used materials for the transmission of electrical signal...
Bonding wires made of aluminum are the most used materials for the transmission of electrical signal...
The reliability of power electronic devices is mainly limited due to thermo-mechanical fatigue of th...
The subject of this study was to investigate the effect of different geometrical loop shapes on the ...
In this study a high frequency mechanical fatigue testing procedure for evaluation of interfacial re...
Development of advanced electronic packages can be drastically affected by implementation of new mat...
Every new development in device performance and packaging design, can drastically affect the reliabi...
Electrical signal transmission in power electronic devices takes place through high-purity aluminum ...
Electrical signal transmission in power electronic devices takes place through high-purity aluminum ...
Electrical signal transmission in power electronic devices takes place through high-purity aluminum ...
In power electronic devices the electrical connections of different components are mainly realized b...
In power electronic devices the electrical connections of different components are mainly realized b...