Lichtleiteranordnung und Verfahren zum Herstellen von Lichtleiteranordnungen

DE 102008029726 A1 UPAB: 20100122 NOVELTY - The arrangement has a separation layer (2) formed on a semiconductor substrate (1), where a waveguide (3) is arranged on the separation layer. The waveguide has a diameter of less than micrometers. A reflecting surface (6) bent opposite to a longitudinal axis of the waveguide is arranged at an end (4) of the waveguide for coupling or uncoupling of light. The expansion amount of the reflecting surface is greater than the diameter of the waveguide, in a direction perpendicular to the substrate. The substrate is made of silicon and the separation layer is made of silicon dioxide. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for manufacturing a light conductor arrangement. USE - Light conductor arrangement for use as an integrated optical circuit (claimed). ADVANTAGE - The reflecting surface bent opposite to the longitudinal axis of the waveguide is arranged at the end of the waveguide for coupling or uncoupling of light, thus permitting wavelength-independent coupling or uncoupling of light at the end of the waveguide. The arrangement can be manufactured in a simple manner with less expenditure