Plasmastempel, Plasmabehandlungsvorrichtung, Verfahren zur Plasmabehandlung und Herstellungsverfahren fuer einen Plasmastempel

WO 2009141143 A1 UPAB: 20091214 NOVELTY - The plasma stamp comprises a gas conductive layer (4), which consists of porous materials, and a cavity (2), which is connected with the gas conductive layer in gas permeable manner and which has an opening (6, 7) to a lower side of the plasma stamp. The gas is passed in the area behind the opening of the cavity in the direction parallel to the surface of the opening through the gas conductive layer. The gas is guidable over the gas conductive layer and/or is deductible from the cavity, which is arranged in a cavity layer (1). The cavity extends up to an upper side of the cavity layer. DETAILED DESCRIPTION - The plasma stamp comprises a gas conductive layer (4), which consists of porous materials, and a cavity (2), which is connected with the gas conductive layer in gas permeable manner and which has an opening (6, 7) to a lower side of the plasma stamp. The gas is passed in the area behind the opening of the cavity in the direction parallel to the surface of the opening through the gas conductive layer. The gas is guidable over the gas conductive layer and/or is deductible from the cavity, which is arranged in a cavity layer (1). The cavity extends up to an upper side of the cavity layer and/or up to a lower side of the cavity layer lying against the top. The lower side of the cavity layer collapses with the lower side of the plasma stamp. The upper side of the cavity layer borders on the cavity and/or the gas is passed in the direction parallel to the surface of the upper side of the cavity layer at the cavity through the gas conductive layer. The gas conductive layer is arranged directly on the cavity layer. A gas impermeable layer (5) is arranged at the side of the gas conductive layer turned away the lower side of the plasma stamp and/or to the surface of the plasma stamp between the upper and lower side of the plasma stamp and/or to the lower side of the plasma stamp. The gas impermeable layer has an opening for conducting the gas and/or an opening for gas discharging. An electrode is arranged on the upper side of the plasma stamp turned away the lower side or on the side of the gas conductive layer turned away the upper side of the plasma stamp and/or the electrode is arranged on the side of the gas impermeable layer turned away the gas conductive layer or the gas conductive layer is an electrode. The cavity has circular, rectangular, quadratic, triangular or polygonal cross-section or base. The cavity layer consists of a material of dielectric, ceramics, polymer, photoresist material and metal. The porous material is a porous metallic material, sintered metal fiber, sintered powder, sintered metal powder or layers of metallic network. The open pore volume is greater than or equal to 95%. The thickness of the cavity layer is less than or equal to 1.5 mm and/or the thickness of the gas conductive layer is less than or equal to 2 mm. A pressure of greater than or equal to 0.5 bar is producible in the cavity and/or the pressure of less than or equal to 1.5 bar is producible in the cavity. A cold alternating current gas discharge or transient gas discharge is producible in the cavity. Two cavities are arranged in an array. The characteristic of the gases, plasma in the cavity and/or the characteristic of the plasma stamp are changeable and/or adjustable in one or two directions parallel to the plasma stamp. The characteristics are gas phase concentration, temperature of the gases, temperature of the plasma, temperature of the cavity layer, temperature of the gas conductive layer, electric field strength, a processing cycle part, a treatment duration and combustion duration of plasma. A plasma coating, ablation, a surface cleaning and/or surface modification with air, oxygen and/or nitrogen containing gases are caused with the plasma stamp. INDEPENDENT CLAIMS are included for: (1) a plasma treatment device; and (2) method for the production of plasma stamp. USE - Plasma stamp useful for plasma treatment device. ADVANTAGE - The plasma stamp is simple and ensures simple and efficient treatment of the plasma