Miniaturized optical systems that couple light from broad area or trapezoid diode laser bars with cw powers up to 100 W into fibers with core diameters between 50 µm and 100 µm have been developed and assembled on smart Direct-Copper-Bond (DCB) system platforms that incorporate active cooling structures as well as hermetic housing facilities. The approach for a fast and flexible joining of the optical elements by a flux-free applied solder is to jet liquid solder spheres onto joining geometries, thus enabling for creating complex shaped solder joint geometries with high accuracies
Joining of micro-optical systems is an important step during the manufacturing process, especially w...
Solder joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based solde...
Soldering using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering ...
Further miniaturization of 3D-integrated hybrid optical systems on smart system platforms requires a...
Miniaturization of photonic devices is required by various applications such as data storage and pro...
Laser beam soldering as a longterm and temperature stable joining alternative to adhesive bonding fo...
Microoptical beam transformation systems for high power diode lasers (HPDL) have been realized to co...
A microoptical beam transformation system for coupling of high power laser diode bars into multimode...
High power diode lasers (HPDL) have become very attractive as an intelligent tool for direct materia...
In this paper we describe the setup of an assembly system for micro-optical elements. This modular s...
New joining techniques are required for the variety of materials used in the manufacture of microsys...
System integration of complex and demanding micro-systems requires advanced packaging technologies. ...
Laser based joining technologies for optical assemblies overcome the limitations of standard fixatio...
Longterm stable and high precise interconnections between small optical components and the optomecha...
Laser-based Solderjet Bumping is a fast, precise and versatile technique for flux-free soldering of ...
Joining of micro-optical systems is an important step during the manufacturing process, especially w...
Solder joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based solde...
Soldering using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering ...
Further miniaturization of 3D-integrated hybrid optical systems on smart system platforms requires a...
Miniaturization of photonic devices is required by various applications such as data storage and pro...
Laser beam soldering as a longterm and temperature stable joining alternative to adhesive bonding fo...
Microoptical beam transformation systems for high power diode lasers (HPDL) have been realized to co...
A microoptical beam transformation system for coupling of high power laser diode bars into multimode...
High power diode lasers (HPDL) have become very attractive as an intelligent tool for direct materia...
In this paper we describe the setup of an assembly system for micro-optical elements. This modular s...
New joining techniques are required for the variety of materials used in the manufacture of microsys...
System integration of complex and demanding micro-systems requires advanced packaging technologies. ...
Laser based joining technologies for optical assemblies overcome the limitations of standard fixatio...
Longterm stable and high precise interconnections between small optical components and the optomecha...
Laser-based Solderjet Bumping is a fast, precise and versatile technique for flux-free soldering of ...
Joining of micro-optical systems is an important step during the manufacturing process, especially w...
Solder joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based solde...
Soldering using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering ...