Throwing light on electronics encapsulation

Fiber optic Bragg gratings (FBG) and innovative sensors for internal mold pressure are being used for load analysis in the process of electronics encapsulation. Along with numerical simulation, they are able to provide insights into polymer behavior during reliability testing. FBGs are capable of providing characterization of various plastics encapsulation processes. These sensors can be useful for load analysis on encapsulated electronics components and provide significant information of the production process, which are impossible with other sensors. The embedded fiber sensors can also be used for determining the gel and glass transition point during the production process, which further enables optimization of curing profiles in terms of stress minimization and process duration. These fiber sensors also have the ability to detect and predict structural damages