The most valuable attribute of 3D Networks-on-Chip (NoCs) is the very small distance between the layers. Yet, this potential will go unrealized without the design of efficient routing methods. In this paper, we introduce 3D MAX, a maximally adaptive routing strategy for fully-connected 3D mesh networks. The proposed routing technique which is developed upon the EbDa theory exploits three key features to realize effective communication across the chip. First, from the turn model’s perspective, the minimum number of turns is prohibited such that the degree of routing adaptiveness is maximized. Second, 3D MAX is designed from an odd-even perspective in order to maintain a balanced traffic distribution. Third, the deadlock-freedom is guarante...
Abstract—Three-dimensional (3D) integration offers greater device integration, reduced signal delay ...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
International audienceNowadays 3D chips are fabricated by stacking 2D layers and manufacturing verti...
The most valuable attribute of 3D Networks-on-Chip (NoCs) is the very small distance between the lay...
The combination of three-dimensional integrated circuits (3D ICs) and Networks-on-Chip (NoCs) offers...
International audienceExisting routing algorithms for 3D deal with regular mesh/torus 3D topologies....
The amalgamation of 3D VLSI technology and Networks-on-Chip (NoCs) offers a promising architectural ...
Three-Dimensional (3D) integration is a solution to the interconnect bottleneck in Two-Dimensional (...
International audience3D integration opens up new opportunities for future multiprocessor chips by e...
International audience3D integration opens up new opportunities for future multiprocessor chips by e...
3D ICs can take advantage of a scalable communication platform, commonly referred to as the Networks...
Three-dimensional Network-On-Chips (3D NOC) are the most efficient communication structures for comp...
The degree of adaptiveness has a major impact on the performance of an adaptive routing method. This...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
Routing algorithm has a significant impact on the overall performance of network-on-chip (NoC) based...
Abstract—Three-dimensional (3D) integration offers greater device integration, reduced signal delay ...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
International audienceNowadays 3D chips are fabricated by stacking 2D layers and manufacturing verti...
The most valuable attribute of 3D Networks-on-Chip (NoCs) is the very small distance between the lay...
The combination of three-dimensional integrated circuits (3D ICs) and Networks-on-Chip (NoCs) offers...
International audienceExisting routing algorithms for 3D deal with regular mesh/torus 3D topologies....
The amalgamation of 3D VLSI technology and Networks-on-Chip (NoCs) offers a promising architectural ...
Three-Dimensional (3D) integration is a solution to the interconnect bottleneck in Two-Dimensional (...
International audience3D integration opens up new opportunities for future multiprocessor chips by e...
International audience3D integration opens up new opportunities for future multiprocessor chips by e...
3D ICs can take advantage of a scalable communication platform, commonly referred to as the Networks...
Three-dimensional Network-On-Chips (3D NOC) are the most efficient communication structures for comp...
The degree of adaptiveness has a major impact on the performance of an adaptive routing method. This...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
Routing algorithm has a significant impact on the overall performance of network-on-chip (NoC) based...
Abstract—Three-dimensional (3D) integration offers greater device integration, reduced signal delay ...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
International audienceNowadays 3D chips are fabricated by stacking 2D layers and manufacturing verti...